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XCC3500ENJARSHR.B

CC35xE 2.4GHz SimpleLink™ Wi-Fi 6 and Bluetooth®Low Energy Wireless MCU

1 Features Microcontroller • Powerful 160MHz Arm® Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption • Flexible configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for improved code

文件:769.75 Kbytes 页数:13 Pages

TI

德州仪器

XCC3501ENJARSHR

CC35xE 2.4GHz SimpleLink™ Wi-Fi 6 and Bluetooth®Low Energy Wireless MCU

1 Features Microcontroller • Powerful 160MHz Arm® Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption • Flexible configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for improved code

文件:769.75 Kbytes 页数:13 Pages

TI

德州仪器

XCC3501ENJARSHR

CC350xE 2.4GHz SimpleLink™ Wi-Fi 6 and Bluetooth®Low Energy Wireless MCU

1 Features Microcontroller • Powerful 160MHz Arm® Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption • Flexible configuration of low-latency TCM (up to 32KB) and cache (32KB or 64KB) for improved code

文件:640.02 Kbytes 页数:13 Pages

TI

德州仪器

XCC3501ENJARSHR.B

CC35xE 2.4GHz SimpleLink™ Wi-Fi 6 and Bluetooth®Low Energy Wireless MCU

1 Features Microcontroller • Powerful 160MHz Arm® Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption • Flexible configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for improved code

文件:769.75 Kbytes 页数:13 Pages

TI

德州仪器

XCC3550ENJARSHR

CC355xE SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU

1 Features Microcontroller • Powerful 160MHz Arm® Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption • Flexible configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for improved code

文件:768.22 Kbytes 页数:13 Pages

TI

德州仪器

XCC3550ENJARSHR

CC355xE SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU

1 Features Microcontroller • Powerful 160MHz Arm® Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption • Flexible configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for improved code

文件:831.29 Kbytes 页数:14 Pages

TI

德州仪器

XCC3550ENJARSHR

CC355xE SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU

1 Features Microcontroller • Powerful 160MHz Arm® Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption • Flexible configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for improved code

文件:774.21 Kbytes 页数:13 Pages

TI

德州仪器

XCC3550ENJARSHR.B

CC355xE SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU

1 Features Microcontroller • Powerful 160MHz Arm® Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption • Flexible configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for improved code

文件:774.21 Kbytes 页数:13 Pages

TI

德州仪器

XCC3550ENJARSHR.B

CC355xE SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU

1 Features Microcontroller • Powerful 160MHz Arm® Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption • Flexible configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for improved code

文件:768.22 Kbytes 页数:13 Pages

TI

德州仪器

XCC3551ENJARSHR

CC355xE SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU

1 Features Microcontroller • Powerful 160MHz Arm® Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption • Flexible configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for improved code

文件:831.29 Kbytes 页数:14 Pages

TI

德州仪器

技术参数

  • 商标:

    Telemecanique

  • 工厂包装数量:

    1

供应商型号品牌批号封装库存备注价格
Excelsys
24+
NA
1087
进口原装正品优势供应
询价
Excelsys
2022+
原厂原包装
6800
全新原装 支持表配单 中国著名电子元器件独立分销
询价
XILINX
11+
QFP
5000
全新原装,绝对正品,现货供应
询价
XILINX
25+
QFP
2317
品牌专业分销商,可以零售
询价
XILINX
23+
BGA
3200
中国领先的XILINX嵌入式专业分销商!原装正品!
询价
XILINX
24+
QFP
3003
询价
XILINX
16+
QFN24
4000
进口原装现货/价格优势!
询价
XILINX
2016+
QFP144
2500
只做原装,假一罚十,公司可开17%增值税发票!
询价
XILINX
25+
QFP
18000
原厂直接发货进口原装
询价
MOTOROLA
24+
BGA
2000
原装现货,可开13%税票
询价
更多XCC供应商 更新时间2025-12-24 14:15:00