CC274xR-Q1, CC274xP-Q1 AutomotiveSimpleLink™ Bluetooth® 5.4 Low Energy Wireless MCU

1 Features Wireless MCU processing elements • Arm® Cortex®-M33 processor (96MHz) with FPU (floating point unit), TrustZone®-M support, and CDE (custom datapath extension) for machine learning acceleration • Algorithm Processing Unit (APU) (96MHz) – Mathematical accelerator for efficient vec

文件：2.19615 Mbytes 页数：74 Pages

TI

德州仪器

CC330x SimpleLink™ Wi-Fi® 6 and Bluetooth® Low Energy Transceiver

1 Features • Highly optimized Wi-Fi® 6 and Bluetooth® Low Energy 5.2 system for low-cost industrial embedded applications • Designed to integrate with any MPU or MCU host capable of running a TCP/IP stack • Wi-Fi 6 – MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax

文件：594.4 Kbytes 页数：10 Pages

TI

德州仪器

CC330x SimpleLink™ Wi-Fi® 6 and Bluetooth® Low Energy Transceiver

1 Features • Highly optimized Wi-Fi® 6 and Bluetooth® Low Energy 5.2 system for low-cost industrial embedded applications • Designed to integrate with any MPU or MCU host capable of running a TCP/IP stack • Wi-Fi 6 – MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax

文件：594.4 Kbytes 页数：10 Pages

TI

德州仪器

CC330xMOD SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Companion Module

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth®Low Energy 5.4 in CC33x1MOD • Companion module to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz PA for complete wireless system with up to +18dBm output power • Operating temperature: –40°C to +85°C

文件：806.2 Kbytes 页数：13 Pages

TI

德州仪器

CC335x SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Companion IC

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® Low Energy 5.4 in CC33x1 devices • Companion IC to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4/5GHz PA for complete wireless solution with up to +20.5dBm output power. • Operating temperature: –40°C

文件：929.35 Kbytes 页数：19 Pages

TI

德州仪器

CC335xMOD SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Companion Module

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® Low Energy 5.4 in CC33x1MOD • Companion module to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz and 5GHz PA for a complete wireless system with up to +18dBm output power • Operating temperature: –40

文件：2.0754 Mbytes 页数：38 Pages

TI

德州仪器

CC335x SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Companion IC

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® Low Energy 5.4 in CC33x1 devices • Companion IC to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4/5GHz PA for complete wireless solution with up to +20.5dBm output power. • Operating temperature: –40°C

文件：929.35 Kbytes 页数：19 Pages

TI

德州仪器

CC335xMOD SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Companion Module

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® Low Energy 5.4 in CC33x1MOD • Companion module to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz and 5GHz PA for a complete wireless system with up to +18dBm output power • Operating temperature: –40

文件：2.0754 Mbytes 页数：38 Pages

TI

德州仪器

CC35xE 2.4GHz SimpleLink™ Wi-Fi 6 and Bluetooth®Low Energy Wireless MCU

1 Features Microcontroller • Powerful 160MHz Arm® Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption • Flexible configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for improved code

文件：769.75 Kbytes 页数：13 Pages

TI

德州仪器

CC350xE 2.4GHz SimpleLink™ Wi-Fi 6 and Bluetooth®Low Energy Wireless MCU

1 Features Microcontroller • Powerful 160MHz Arm® Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption • Flexible configuration of low-latency TCM (up to 32KB) and cache (32KB or 64KB) for improved code

文件：640.02 Kbytes 页数：13 Pages

TI

德州仪器