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WFBGA

Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide.

FEATURES Cutting-edgetechnologyandexpandingpackageofferingsprovideaplatformfromprototype-toproduction Copper(Cu)wireinterconnectmethodandhigh-volumeinfrastructureatallAmkorCABGAproductionfacilities LowestcostusingAmkorstandardCABGAbillofmaterialsselection 1.

amkorAmkor Technology

安靠封装测试安靠封装测试(上海)有限公司

供应商型号品牌批号封装库存备注价格
WINFLASH
17+
NA
6200
100%原装正品现货
询价
23+
LGA
390
原装现货假一赔十
询价
N/A
2450+
LGA
6540
只做原装正品假一赔十为客户做到零风险!!
询价
CANDD
23+
原厂原包
19960
只做进口原装 终端工厂免费送样
询价
MURATA/村田
2021+
DIP
11000
十年专营原装现货,假一赔十
询价
C&DTECH
23+
65480
询价
C&DTECHNOLOGIES
23+
new
11200
原厂授权一级代理、全球订货优势渠道、可提供一站式BO
询价
DALE (VISHAY)
23+
原厂原封
20000
订货1周 原装正品
询价
更多WFBGA供应商 更新时间2025-7-27 16:00:00