首页>WED3C7558M350BM>规格书详情
WED3C7558M350BM中文资料PDF规格书
相关芯片规格书
更多- WED3C7410E16M450BHM
- WED3C7410E16M400BH9M
- WED3C7558M300BM
- WED3C7410E16M400BH9I
- WED3C7410E16M-XBX
- WED3C7558M350BC
- WED3C7410E16M-XBHX
- WED3C7410E16M450BH9M
- WED3C7558M300BC
- WED3C7410E16M400BHM
- WED3C7410E16M450BHI
- WED3C7410E16M450BC
- WED3C7410E16M450BHC
- WED3C7410E16M450BH9C
- WED3C7410E16M400BHI
- WED3C7558M300BI
- WED3C7410E16M400BH9C
- WED3C7410E16M450BM
WED3C7558M350BM规格书详情
OVERVIEW
The WEDC 755/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and dynamic power management.
The WED3C7558M-XBX multichip package consists of:
■ 755 RISC processor
■ Dedicated 1MB SSRAM L2 cache, confi gured as 128Kx72
■ 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)
■ Core Frequency/L2 Cache Frequency (300MHz/ 150MHz, 350MHz/175MHz)
■ Maximum 60x Bus frequency = 66MHz
FEATURES
■ Footprint compatible with WED3C750A8M-200BX
■ Footprint compatible with Motorola MPC 745
产品属性
- 型号：
WED3C7558M350BM
- 制造商：
WEDC
- 制造商全称：
White Electronic Designs Corporation
- 功能描述：
RISC Microprocessor Multichip Package
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
23+ |
BGA |
9800 |
现货库存,全新原装,特价销售 |
询价 | |||
WHI |
1535+ |
878 |
询价 | ||||
3CD |
21+ |
3cd |
5000 |
原装现货/假一赔十/支持第三方检验 |
询价 | ||
WEDC |
19+ |
BGA |
35210 |
原装现货/放心购买 |
询价 | ||
3CD |
2022+ |
3cd |
8600 |
英瑞芯只做原装正品 |
询价 | ||
WENGRY |
22+ |
SMD |
2679 |
原装优势!绝对公司现货!可长期供货! |
询价 | ||
专营WEDC |
2102+ |
SOP |
6854 |
只做原厂原装正品假一赔十! |
询价 | ||
WEDC |
18+ |
SOP |
85600 |
保证进口原装可开17%增值税发票 |
询价 | ||
微芯/美高森美 |
22+ |
NA |
500000 |
万三科技,秉承原装,购芯无忧 |
询价 | ||
WEDC |
2021+ |
20 |
100500 |
一级代理专营品牌!原装正品,优势现货,长期排单到货 |
询价 |
