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WED3C7558M300BI中文资料PDF规格书
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WED3C7558M300BI规格书详情
OVERVIEW
The WEDC 755/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and dynamic power management.
The WED3C7558M-XBX multichip package consists of:
■ 755 RISC processor
■ Dedicated 1MB SSRAM L2 cache, confi gured as 128Kx72
■ 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)
■ Core Frequency/L2 Cache Frequency (300MHz/ 150MHz, 350MHz/175MHz)
■ Maximum 60x Bus frequency = 66MHz
FEATURES
■ Footprint compatible with WED3C750A8M-200BX
■ Footprint compatible with Motorola MPC 745
产品属性
- 型号：
WED3C7558M300BI
- 制造商：
WEDC
- 制造商全称：
White Electronic Designs Corporation
- 功能描述：
RISC Microprocessor Multichip Package
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
WEDC |
21+ |
BGA |
645 |
航宇科工半导体-央企合格优秀供方! |
询价 | ||
WED |
22+ |
BGA119 |
9852 |
只做原装正品现货!或订货假一赔十! |
询价 | ||
WED |
23+ |
BGA |
1733 |
专业优势供应 |
询价 | ||
专营WEDC |
2102+ |
SOP |
6854 |
只做原厂原装正品假一赔十! |
询价 | ||
WEDC |
23+ |
NA/ |
4250 |
原装现货,当天可交货,原型号开票 |
询价 | ||
NULL |
2138+ |
BGA |
8960 |
专营BGA,QFP原装现货,假一赔十 |
询价 | ||
WEDC |
QQ咨询 |
BGA |
188 |
全新原装 研究所指定供货商 |
询价 | ||
3CD |
21+ |
3cd |
5000 |
原装现货/假一赔十/支持第三方检验 |
询价 | ||
微芯/美高森美 |
22+ |
NA |
500000 |
万三科技,秉承原装,购芯无忧 |
询价 | ||
WEDC |
19+ |
BGA |
35210 |
原装现货/放心购买 |
询价 |
