首页>WED3C7410E16M400BH9C>规格书详情
WED3C7410E16M400BH9C中文资料WEDC数据手册PDF规格书
相关芯片规格书
更多WED3C7410E16M400BH9C规格书详情
OVERVIEW
The WEDC 7410E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and dynamic power management.
The WED3C7410E16M-XBHX multichip package consists of:
■ 7410E AltiVec™ RISC processor
■ Dedicated 2MB SSRAM L2 cache, confi gured as 256Kx72
■ 21mmx25mm, 255 HiTCE™ Ball Grid Array (CBGA)
■ Core frequency = 450 or 400MHz @ 1.8V
■ Maximum L2 Cache frequency = 200MHz
■ Maximum 60x Bus frequency = 100MHz
FEATURES
■ Footprint compatible with WED3C7410E16M-XBX, WED3C7558M-XBX and WED3C750A8M-200BX
■ Implementation of Altivec™ technology instruction set
■ Optional, high-bandwidth MPX bus interface
■ HiTCE™ interposer for TCE compatibility to laminate substrates for increased Board level reliability
■ Available with eutectic or high lead solder balls
产品属性
- 型号:
WED3C7410E16M400BH9C
- 制造商:
WEDC
- 制造商全称:
White Electronic Designs Corporation
- 功能描述:
7410E RISC Microprocessor HiTCETM Multichip Package
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
Microsemi(美高森美) |
24+ |
CBGA255 |
7350 |
现货供应,当天可交货!免费送样,原厂技术支持!!! |
询价 | ||
WEDC |
24+ |
NA/ |
3268 |
原装现货,当天可交货,原型号开票 |
询价 | ||
WEDC |
25+ |
25000 |
原厂原包 深圳现货 主打品牌 假一赔百 可开票! |
询价 | |||
WED |
24+ |
BGA |
8540 |
只做原装正品现货或订货假一赔十! |
询价 | ||
WHITE |
BGA |
3350 |
一级代理 原装正品假一罚十价格优势长期供货 |
询价 | |||
WEDC |
23+ |
BGA |
3000 |
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、 |
询价 | ||
WENGRY |
25+ |
SMD |
2679 |
原装优势!绝对公司现货!可长期供货! |
询价 | ||
NULL |
2138+ |
BGA |
8960 |
专营BGA,QFP原装现货,假一赔十 |
询价 | ||
WEDC |
25+23+ |
BGA |
44721 |
绝对原装正品全新进口深圳现货 |
询价 | ||
WEDC |
25+ |
BGA |
12500 |
全新原装现货,假一赔十 |
询价 |


