ST portfolio for smartphone platforms

TYPICAL APPLICATIONS • Contactless test factory automation and after sales services • Life proof hole-less personal devices • Contactless accessories • Contactless personal equipment docking hub and data transfer KEY FEATURE • True 10-finger multi touch • High SNR, hign noise immunity •

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Advanced 1.5 Mpixel, backside illuminated Global Shutter, ultra compact sensor, with high QE, high MTF, excellent PLS, and full-features

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Consumer Global Shutter 1.5Mp

The VD56G3 is a global shutter image sensor optimized for near infrared scenes. The sensor captures up to 100 frames per second in a 1124 x 1364 resolution format. The pixel construction of this device minimises crosstalk. \n 主要特性\nGlobal shutter technology, ST proprietary single layer3D stack • Global shutter technology, ST proprietary single layer \n • 3D stacked sensor 40 nm/65 nm \n • 2.61 µm x 2.61 µm BSI pixel with full DTI (deep trench isolation) \n • High-performance with excellent \n •QE (quantum efficiency) \n •MTF (modulation transfer function) up to near IR \n •Perfect PLS (sh;

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VD56G3 promodules: Camera module evaluation samples for instant integration of VD56G3 sensor

Features • “Promodules”: turnkey camera modules for evaluation: – Including VD56G3 image sensor, lens holder, lens, and plug-and-play flex connection. – Lens focused, glued, and tested in cleanroom environment using specialized equipment. – Small footprint down to 6.5 mm square. • Various l

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VD56G3 S-Board: Hardware MIPI CSI-2 kit for the evaluation and integration of VD56G3 image sensor

Features • Comprehensive hardware kit including: – Sensor board that embeds VD56G3 image sensor with FFC output connector. – M12 lens holder screwed on the board. – Default nonglued lens that user can focus according to their needs or replace by another compatible lens. – Ribbon cable to co

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