ST portfolio for smartphone platforms

TYPICAL APPLICATIONS • Contactless test factory automation and after sales services • Life proof hole-less personal devices • Contactless accessories • Contactless personal equipment docking hub and data transfer KEY FEATURE • True 10-finger multi touch • High SNR, hign noise immunity •

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STMICROELECTRONICS

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Advanced 640 x 600 pixel, backside illuminated Global Shutter, ultra compact sensor, with high QE, high MTF, excellent PLS, and full-features

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STMICROELECTRONICS

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Compact and high-sensitivity 0.38 megapixel monochrome global shutter image sensor

The VD55G0 is a global shutter image sensor with high BSI performance which captures up to 210 frames per second in a 644 x 604 resolution format. The pixel construction of this device minimizes crosstalk while enabling a high quantum efficiency (QE) in the near infrared spectrum.\n\n • Global shutter technology, ST proprietary single layer \n• 2.61 µm x 2.61 µm BSI pixel with full CDTI (capacitive deep trench) \n• Smallest sensor on market with:Compact die size: 2.6 mm x 2.5 mm640 pixel x 600 pixel resolutionVery small pixel array, 1.67 mm x 1.57 mmOptical format between 1/9 inc;

ST

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VD55G0 promodules: Camera module evaluation samples for instant integration of VD55G0 sensor

Features • “Promodules”: turnkey camera modules for evaluation: – Including VD55G0 image sensor, lens holder, lens, and plug-and-play flex connection. – Lens focused, glued, and tested in cleanroom environment using specialized equipment. – Small footprint down to 5.0 mm square. • Various l

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STMICROELECTRONICS

意法半导体