BIPOLAR ANALOG INTEGRATED CIRCUIT

DESCRIPTION The μPC8211TK is a silicon germanium (SiGe) monolithic integrated circuit designed as low noise amplifier for GPS and mobile communications. The package is 6-pin lead-less minimold, suitable for surface mount. This IC is manufactured using our 50 GHz fmax UHS2 (Ultra High Speed Proc

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丝印：6G；Package：PKG；BIPOLAR ANALOG INTEGRATED CIRCUIT

DESCRIPTION The μPC8211TK is a silicon germanium (SiGe) monolithic integrated circuit designed as low noise amplifier for GPS and mobile communications. The package is 6-pin lead-less minimold, suitable for surface mount. This IC is manufactured using our 50 GHz fmax UHS2 (Ultra High Speed Proc

文件：315.52 Kbytes 页数：13 Pages

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瑞萨

丝印：6G；Package：PKG；BIPOLAR ANALOG INTEGRATED CIRCUIT

DESCRIPTION The μPC8211TK is a silicon germanium (SiGe) monolithic integrated circuit designed as low noise amplifier for GPS and mobile communications. The package is 6-pin lead-less minimold, suitable for surface mount. This IC is manufactured using our 50 GHz fmax UHS2 (Ultra High Speed Proc

文件：315.52 Kbytes 页数：13 Pages

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BIPOLAR ANALOG INTEGRATED CIRCUIT

FEATURES • Low noise : NF = 1.3 dB TYP. @ VCC = 3.0 V • High gain : GP = 27.0 dB TYP. @ VCC = 3.0 V • Low distortion : OIP3 = +12.5 dBm TYP. @ VCC = 3.0 V • High-density surface mounting : 8-pin lead-less minimold package (2.0 × 2.2 × 0.5 mm) • High performance with minimum external component

文件：297.3 Kbytes 页数：11 Pages

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丝印：8215；BIPOLAR ANALOG INTEGRATED CIRCUIT

FEATURES • Low noise : NF = 1.3 dB TYP. @ VCC = 3.0 V • High gain : GP = 27.0 dB TYP. @ VCC = 3.0 V • Low distortion : OIP3 = +12.5 dBm TYP. @ VCC = 3.0 V • High-density surface mounting : 8-pin lead-less minimold package (2.0 × 2.2 × 0.5 mm) • High performance with minimum external component

文件：297.3 Kbytes 页数：11 Pages

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丝印：8215；BIPOLAR ANALOG INTEGRATED CIRCUIT

FEATURES • Low noise : NF = 1.3 dB TYP. @ VCC = 3.0 V • High gain : GP = 27.0 dB TYP. @ VCC = 3.0 V • Low distortion : OIP3 = +12.5 dBm TYP. @ VCC = 3.0 V • High-density surface mounting : 8-pin lead-less minimold package (2.0 × 2.2 × 0.5 mm) • High performance with minimum external component

文件：297.3 Kbytes 页数：11 Pages

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BIPOLAR ANALOG INTEGRATED CIRCUIT

FEATURES • Low noise : NF = 4.2 dBm TYP. • High Gain : CG = 22.5 dB TYP. • Low Current Consumption : ICC = 11.5 mA TYP. • Packaged in 8-pin lead-less minimold (2.0 × 2.2 × 0.5 mm) suitable for high-density surface mounting

文件：249.86 Kbytes 页数：13 Pages

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丝印：8217；BIPOLAR ANALOG INTEGRATED CIRCUIT

FEATURES • Low noise : NF = 4.2 dBm TYP. • High Gain : CG = 22.5 dB TYP. • Low Current Consumption : ICC = 11.5 mA TYP. • Packaged in 8-pin lead-less minimold (2.0 × 2.2 × 0.5 mm) suitable for high-density surface mounting

文件：249.86 Kbytes 页数：13 Pages

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Si ANALOG INTEGRATED CIRCUIT

FEATURES • Output Power : Pout = +20.5 dBm MIN. @ Pin = −19 dBm, f = 1.9 GHz • Operation Current : Iop = 150 mA TYP. • Single Supply Voltage : VDS = 3.0 V TYP. • Suitable for High-density Surface Mounting : 16-pin Plastic TSON package (3.3 × 2.3 × 0.6 mm)

文件：264.64 Kbytes 页数：14 Pages

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丝印：8218；Package：TSON；Si ANALOG INTEGRATED CIRCUIT

FEATURES • Output Power : Pout = +20.5 dBm MIN. @ Pin = −19 dBm, f = 1.9 GHz • Operation Current : Iop = 150 mA TYP. • Single Supply Voltage : VDS = 3.0 V TYP. • Suitable for High-density Surface Mounting : 16-pin Plastic TSON package (3.3 × 2.3 × 0.6 mm)

文件：264.64 Kbytes 页数：14 Pages

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