3 V, SUPER MINIMOLD SILICON MMIC AMPLIFIER FOR MOBILE COMMUNICATIONS

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3 V, SUPER MINIMOLD 900 MHz Si MMIC AMPLIFIER

文件：240.87 Kbytes 页数：9 Pages

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3 V, SUPER MINIMOLD SILICON MMIC AMPLIFIER FOR MOBILE COMMUMICATIONS

DESCRIPTION\nThe µPC2747TB, µPC2748TB are silicon monolithic integrated circuits designed as amplifier for mobile communications. These ICs are packaged in super minimold package which is smaller than conventional minimold.\nThe µPC2747TB, µPC2748TB have compatible pin connections and performance to • High-density surface mounting :\n   6-pin super minimold package\n• Supply voltage : VCC = 2.7 to 3.3 V\n• Noise figure\n   : µPC2747TB ; NF = 3.3 dB TYP. @ f = 900 MHz\n   : µPC2748TB ; NF = 2.8 dB TYP. @ f = 900 MHz\n• Upper limit operating frequency\n   : µPC2747TB ; fu = 1.8 GHz TYP.\n   : µPC;

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3 V, 900 MHz Si MMIC AMPLIFIER

DESCRIPTION\nThe UPC2747T is a Silicon Monolithic integrated circuit which is manufactured using the NESAT III process. The NESAT III process produces transistors with fT approaching 20 GHz.\nThis amplifier was designed for 900 MHz receivers in cellular and cordless telephone applications. Operating • LOW VOLTAGE - LOW CURRENT: 5 mA at 3 V\n• LOW POWER CONSUMPTION: 15 mW TYP\n• SUPER SMALL PACKAGE\n• TAPE AND REEL PACKAGING OPTION AVAILABLE;

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Package：6-TSSOP，SC-88，SOT-363；包装：卷带（TR） 类别：RF/IF，射频/中频和 RFID 射频放大器 描述：IC AMP CELL 900MHZ-1.5GHZ SOT363

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包装：盒 类别：开发板，套件，编程器 射频评估和开发套件，开发板 描述：EVAL BOARD FOR UPC2747TB

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