丝印：TSSOP；Package：HCS74Q；SN74HCS74-Q1 Automotive Schmitt-Trigger Input Dual D-Type Positive-Edge-Triggered Flip-Flops With Clear and Preset

文件：1.42704 Mbytes 页数：25 Pages

TI

德州仪器

丝印：TSSOP-16EP；Package：T16E；LOW NOISE SINGLE PHASE FULL WAVE DIRECT PWM MOTOR DRIVER

Features • Single-Phase Full Wave BLDC Fan/Motor Drive with BTL Output (BTL Amplifier Gain = 49dB) • Low Noise Architecture • Wide Operating Voltage Range: 2.4V to 18V • PWM Speed Control with External PWM Input • DC Voltage Speed Control by Adjusting VCONT and RMI Voltage • Hall Bias Outp

文件：977.25 Kbytes 页数：16 Pages

DIODES

美台半导体

丝印：TSSOP8；Low Power Dual Voltage Comparators

Description These devices consist of two independent low voltage comparators designed specifically to operate from a single supply over a wide range of voltages. Operation from split power supplies is also possible. These comparators also have a unique characteristic in that the input common-mod

文件：264.64 Kbytes 页数：15 Pages

STMICROELECTRONICS

意法半导体

丝印：TSSOP8；Low Power Dual Voltage Comparators

Description These devices consist of two independent low voltage comparators designed specifically to operate from a single supply over a wide range of voltages. Operation from split power supplies is also possible. These comparators also have a unique characteristic in that the input common-mod

文件：264.64 Kbytes 页数：15 Pages

STMICROELECTRONICS

意法半导体

丝印：TSSOP14；Package：B714AI；Precision rail-to-rail input / output 36 V, 6 MHz op-amps

文件：3.30826 Mbytes 页数：36 Pages

STMICROELECTRONICS

意法半导体

丝印：TSSOP14；Package：B714AY；Precision rail-to-rail input / output 36 V, 6 MHz op-amps

文件：3.30826 Mbytes 页数：36 Pages

STMICROELECTRONICS

意法半导体

丝印：TSSOP14；Package：B714I；Precision rail-to-rail input / output 36 V, 6 MHz op-amps

文件：3.30826 Mbytes 页数：36 Pages

STMICROELECTRONICS

意法半导体

丝印：TSSOP14；Package：B714IY；Precision rail-to-rail input / output 36 V, 6 MHz op-amps

文件：3.30826 Mbytes 页数：36 Pages

STMICROELECTRONICS

意法半导体

ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based

FEATURES Cu wire interconnect for low cost Standard JEDEC package outlines Multi-die production capability Turnkey test services, including strip test options ExposedPad configuration for increased thermal efficiency Up to 60% improvement in Theta JA (compared to standard TSSOP or

文件：780.44 Kbytes 页数：3 Pages

amkor

安靠封装测试

Silver Wirebonding

KEY FEATURES Ag-Alloy wire is softer than Cu wire resulting in lower Al-Splash and lower risk of bond pad damage Ag-Alloy wire has a wide process window that improves manufacturability for devices with fragile bond pad structures

文件：411.98 Kbytes 页数：2 Pages

amkor

安靠封装测试