TSON8-FL (Flat Lead) is a smaller package (3.3 x 3.3 mm) with thermal enhancments that give a 64% reduction in footprint area compared with standard SOIC 8 ld package

FEATURES Small and thermally enhanced package with the same power dissipation but 64% less footprint area than SOIC 8 ld Dual Cu Clip interconnect for better heat dissipation efficiency Clip + wire and multiple wire options are also available Turnkey with test and packing services Gr

文件：928.66 Kbytes 页数：2 Pages

amkor

安靠科技

This package is available in both JEDEC and JEITA package outlines.

FEATURES Thin and thermally enhanced package, the same size as SOIC 8 ld Dual Cu Clip interconnect for better heat dissipation efficiency Clip + wire and multiple wire options are also available Turnkey with test and packing services Green materials: Pb-free plating & halogen-free mold c

文件：676.68 Kbytes 页数：2 Pages

amkor

安靠科技

DIP-3

VishayVishay Siliconix

威世威世科技公司

上传：深圳市神舟芯电子科技有限公司

DIP-3

VishayVishay Siliconix

威世威世科技公司

上传：深圳市神舟芯电子科技有限公司

DIP-3

VishayVishay Siliconix

威世威世科技公司

上传：深圳市神舟芯电子科技有限公司