This package is available in both JEDEC and JEITA package outlines.

FEATURES Thin and thermally enhanced package, the same size as SOIC 8 ld Dual Cu Clip interconnect for better heat dissipation efficiency Clip + wire and multiple wire options are also available Turnkey with test and packing services Green materials: Pb-free plating & halogen-free mold c

文件：676.68 Kbytes 页数：2 Pages

AMKOR

安靠科技

TSON8-FL (Flat Lead) is a smaller package (3.3 x 3.3 mm) with thermal enhancments that give a 64% reduction in footprint area compared with standard SOIC 8 ld package

FEATURES Small and thermally enhanced package with the same power dissipation but 64% less footprint area than SOIC 8 ld Dual Cu Clip interconnect for better heat dissipation efficiency Clip + wire and multiple wire options are also available Turnkey with test and packing services Gr

文件：928.66 Kbytes 页数：2 Pages

AMKOR

安靠科技

汽车电子连接器

SAMTEC/砷泰

上传：天津市博通航睿技术有限公司

汽车电子连接器

SAMTEC/砷泰

上传：天津市博通航睿技术有限公司

SOP-

BOURNS/邦思

上传：深圳市卓越微芯电子有限公司