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TDG-XX

909 Rahway Avenue

文件:75.12 Kbytes 页数:1 Pages

ADAM-TECH

亚当科技

TDG100E90BSP

GaN HEMTs

Gallium nitride devices have revolutionized power conversion in other industries and are now available in high reliability qualified form with plastic encapsulated packaging that has undergone stringent reliability and electrical testing to ensure mission critical success. The Teledyne HiRel GaN HEM

Teledyne HiRel

Teledyne HiRel

TDG1026KCS-R6

6类屏蔽RJ45(8×8)直角型Keystone耦合器

An exclusive product design from L-com, the new right angle series of Category 5e, 6 and 6a couplers offer true 90° connectivity while meeting Category standards. These unique right angle keystone couplers are designed to address tight fit applications commonly seen with wall plates and some patch p • 高性能6类直角型耦合器适用于面板、墙装面板及接线盒安装情形\n• 布线方式同时符合EIA568A和EIA568B两种标准,从而能够兼容所有安装情形,而且RJ45插座符合TIA-1096标准\n• 屏蔽插座可实现EMI/RFI干扰防护\n;

L-com

英飞畅

TDG1026-8C

适配器/接口转换器

L-com

英飞畅

TDGL002

包装:盒 类别:开发板,套件,编程器 评估板 - 嵌入式 - MCU,DSP 描述:CHIPKIT UNO32 PIC32MX320F128

MICROCHIP

微芯科技

TDGL003

包装:盒 类别:开发板,套件,编程器 评估板 - 嵌入式 - MCU,DSP 描述:CHIPKIT MAX32 PIC32MX795F512

MICROCHIP

微芯科技

TDGL004

包装:盒 类别:开发板,套件,编程器 评估板 - 嵌入式 - MCU,DSP 描述:CEREBOT MX7 PIC32MX795F512L

MICROCHIP

微芯科技

技术参数

  • ​D/S:

  • Status:

    Active

  • Package:

    GaNPX™

  • Voltage:

    100V

  • Current:

    90A

  • Rds (ON):

    7 mOhm(typ)

  • Spi​ceModel​:

  • Description:

    Ruggedized Plastic Bottom-Side Cooled​ GaN FET in GaNPX® Packaging

供应商型号品牌批号封装库存备注价格
TOSHIBA
11+
DIP18
8000
全新原装,绝对正品现货供应
询价
LCOM
05+
原厂原装
4536
只做全新原装真实现货供应
询价
24+
678
原装现货假一罚十
询价
TOSHIBA
24+
DIP
3500
原装现货,可开13%税票
询价
TOSHIBA
24+
DIP14
5000
自己现货
询价
Microchip
1706+
?
11520
只做原装进口,假一罚十
询价
Microchip
23+
NA
10021
专业电子元器件供应链正迈科技特价代理特价,原装元器件供应,支持开发样品
询价
MicrochipTechnology
24+
SMD
6000
开发板和工具包-PIC/DSPICchipKITuC32DevelopmentBoar
询价
L-CO
23+
NA
118
专做原装正品,假一罚百!
询价
TOS
25+23+
DIP16
18643
绝对原装正品全新进口深圳现货
询价
更多TDG供应商 更新时间2026-1-29 11:04:00