首页 >TDA4664>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
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HighQ,highself-resonantfrequency SpecialFeatures •HighQ,highself-resonant frequency •Highvoltageapplication •Singlelayeror3-piuniversal wound •Lowcost •Varnishcoated •Operatingtemperature: phenolic-55to+125°C iron&ferrite-55to+105°C •Currenttocause35°Cmaximum temperaturerise | ETCList of Unclassifed Manufacturers 未分类制造商 | ETC | ||
HighQ,highself-resonantfrequency | BournsBourns Electronic Solutions 伯恩斯 | Bourns | ||
VarnishedChokes | BournsBourns Electronic Solutions 伯恩斯 | Bourns | ||
Dual,3V,CMOS,LVDSDifferentialLineReceiver GENERALDESCRIPTION TheADN4664isadual,CMOS,lowvoltagedifferentialsignaling(LVDS)linereceiverofferingdataratesofover400Mbps(200MHz)andultralowpowerconsumption.Itfeaturesaflow-throughpinoutforeasyPCBlayoutandseparationofinputandoutputsignals. Thedeviceacc | ADAnalog Devices 亚德诺亚德诺半导体技术有限公司 | AD | ||
LVDSandM-LVDSCircuitImplementationGuide INTRODUCTION Lowvoltagedifferentialsignaling(LVDS)isastandardforcommunicatingathighspeedinpoint-to-pointapplications.MultipointLVDS(M-LVDS)isasimilarstandardformultipointapplications.BothLVDSandM-LVDSusedifferentialsignaling,atwo-wirecommunicationmethodwherer | ADAnalog Devices 亚德诺亚德诺半导体技术有限公司 | AD | ||
Dual,3V,CMOS,LVDSDifferentialLineReceiver GENERALDESCRIPTION TheADN4664isadual,CMOS,lowvoltagedifferentialsignaling(LVDS)linereceiverofferingdataratesofover400Mbps(200MHz)andultralowpowerconsumption.Itfeaturesaflow-throughpinoutforeasyPCBlayoutandseparationofinputandoutputsignals. Thedeviceacc | ADAnalog Devices 亚德诺亚德诺半导体技术有限公司 | AD | ||
SwitchingPowerTransistor(8ANPN) SwitchingPowerTransistor8ANPN | SHINDENGENShindengen Electric Mfg.Co.Ltd 日本新电元工业株式会社 | SHINDENGEN | ||
5.5-16GHzVariableGainAmplifier | UMS United Monolithic Semiconductors | UMS | ||
FilterlessHighEfficiency1.1WSwitchingAudioAmplifier | NSCNational Semiconductor (TI) 美国国家半导体美国国家半导体公司 | NSC | ||
60V,300WHybridStep-DownModuleBusConverter DESCRIPTION TheLTM®4660isacomplete300Woutputswitching modehybrid-topologystep-downDC/DCμModule® micromodule)nonisolatedbusconverter.Itsexposed powerinductorresidesonthetopofthepackage,providing anintrinsicpathforheattodissipateupandout ofthemodule—awayfro | ADAnalog Devices 亚德诺亚德诺半导体技术有限公司 | AD |
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