STY30NA50中文资料意法半导体数据手册PDF规格书

DESCRIPTION

The Max247TM package is a new high volume power package exibiting the same footprint as the industry standard TO-247, but designed to accomodate much larger silicon chips, normally supplied in bigger packages such as TO-264. The increased die capacity makes the device ideal to reduce component count in multiple paralleled designs and save board space with respect to larger packages.

■ TYPICAL RDS(on) = 0.15 Ω

■ EFFICIENT AND RELIABLE MOUNTING THROUGH CLIP

■ ± 30V GATE TO SOURCE VOLTAGE RATING

■ REPETITIVE AVALANCHE TESTED

■ LOW INTRINSIC CAPACITANCE

■ 100 AVALANCHE TESTED

■ GATE CHARGE MINIMIZED

■ REDUCED THRESHOLD VOLTAGE SPREAD

APPLICATIONS

■ HIGH CURRENT, HIGH SPEED SWITCHING

■ SWITCH MODE POWER SUPPLIES (SMPS)

■ DC-AC CONVERTERS FOR WELDING EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES (UPS)