STY25NA60中文资料意法半导体数据手册PDF规格书

DESCRIPTION

The Max247 package is a new high volume power package exibiting the same footprint as the industry standard TO-247, but designed to accomodate much larger silicon chips, normally supplied in bigger packages such as TO-264.The increased die capacity makes the device idealto reduce component count in multiple paralleled designs and save board space with respect to larger packages.

■ TYPICAL RDS(on) = 0.225 Ω

■ EFFICIENT AND RELIABLE MOUNTING THROUGH CLIP

■ ± 30V GATE TO SOURCE VOLTAGE RATING

■ 100 AVALANCHE TESTED

■ LOW INTRINSIC CAPACITANCE

■ GATE CHARGE MINIMIZED

■ REDUCED VOLTAGE SPREAD

APPLICATIONS

■ HIGH CURRENT, HIGH SPEED SWITCHING

■ SWITCH MODE POWER SUPPLY (SMPS)

■ DC-AC CONVERTER FOR WELDING EQUIPMENT AND UNINTERRUPTABLE POWER SUPPLY AND MOTOR DRIVE