STGIPN3H60AT数据手册分立半导体产品的功率驱动器模块规格书PDF

描述 Description

This intelligent power module implements a compact, high performance AC motor drive in a simple, rugged design. It is composed of six IGBTs with freewheeling diodes and three half-bridge HVICs for gate driving, providing low electromagnetic interference (EMI) characteristics with optimized switching speed. The package is optimized for thermal performance and compactness in built-in motor applications, or other low power applications where assembly space is limited. This IPM includes an operational amplifier, completely uncommitted, and a comparator that can be used to design a fast and efficient protection circuit.

特性 Features

• IPM 3 A, 600 V, 3-phase IGBT inverter bridge including control ICs for gate driving and freewheeling diodes
• Optimized for low electromagnetic interferences
• VCE(sat) negative temperature coefficient
• 3.3 V, 5 V, 15 V CMOS/TTL input comparators with hysteresis and pull-down/pull-up resistors
• Undervoltage lockout
• Internal bootstrap diode
• Interlocking function
• Optimized pinout for easy board layout
• 85 kΩ NTC for temperature control (UL1434 CA 2 and 4)

简介

STGIPN3H60AT属于分立半导体产品的功率驱动器模块。由制造生产的STGIPN3H60AT功率驱动器模块功率驱动器模块为电源组件（通常为半桥或单相、两相或三相配置的 IGBT 和 MOSFET）提供物理防护。功率半导体或裸片将焊接或烧结在基材上，后者可承载功率半导体并在需要时提供电和热触点以及电绝缘。功率模块提供更高的功率密度，并且在许多情况下更可靠且更易于冷却。