SPC584B70E3中文资料用于汽车一般用途应用的32位Power Architecture MCU - Chorus系列数据手册ST规格书

特性 Features

• AEC-Q100 qualified
• High performance e200z420
•32-bit Power Architecture technology CPU
•Core frequency as high as 120 MHz
•Variable Length Encoding (VLE)
• 2112 KB (2048 KB code flash + 64 KB data flash) on-chip flash memory: supports read during program and erase operations, and multiple blocks allowing EEPROM emulation
• 176 KB HSM dedicated flash memory (144 KB code + 32 KB data)
• 128 KB on-chip general-purpose SRAM (in addition to 64 KB core local data RAM
• Crossbar switch architecture for concurrent access to peripherals, Flash, or RAM from multiple bus masters with end-to-end ECC
• Multi-channel direct memory access controller (eDMA) with 64 channels
• 1 interrupt controller (INTC)
• Comprehensive new generation ASIL-B safety concept
•ASIL-B of ISO 26262
•FCCU for collection and reaction to failure notifications
•Memory Error Management Unit (MEMU) for collection and reporting of error events in memories
•Cyclic redundancy check (CRC) unit
• Enhanced low power support
•Ultra low power STANDBY
•Smart Wake-up Unit
•Fast wake-up and execute from RAM
• Enhanced modular IO subsystem (eMIOS): up to 64 timed I/O channels with 16-bit counter resolution
• Body cross triggering unit (BCTU)
•Triggers ADC conversions from any eMIOS channel
•Triggers ADC conversions from up to 2 dedicated PIT_RTIs
• Enhanced analog-to-digital converter system with:
•2 independent fast 12-bit SAR analog converters
•1 supervisor 12-bit SAR analog converter
•1 10-bit SAR analog converter with STDBY mode support
• Communication interfaces
•1 Ethernet controller 10/100 Mbps, compliant IEEE 802.3-2008
•8 MCAN interfaces with advanced shared memory scheme and ISO CAN-FD support
•14 LINFlexD modules
•7 Deserial Serial Peripheral Interface (DSPI) modules
• Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell
• Nexus Development Interface (NDI) per IEEE-ISTO 5001-2003 standard, with some support for 2010 standard
• Boot Assist Flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART
• Junction temperature range -40 °C to 150 °C