SOIC

ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based

FEATURES Cuwireinterconnectforlowcost StandardJEDECpackageoutlines Multi-dieproductioncapability Turnkeytestservices,includingstriptestoptions ExposedPadconfigurationforincreasedthermalefficiency Upto60%improvementinThetaJA(comparedtostandardTSSOPor

SOIC

Silver Wirebonding

KEYFEATURES Ag-AlloywireissofterthanCuwireresultinginlowerAl-Splashandlowerriskofbondpaddamage Ag-Alloywirehasawideprocesswindowthatimprovesmanufacturabilityfordeviceswithfragilebondpadstructures

SOIC

SOIC (Small Outline IC Package) is a leadframe based, plastic encapsulated package

FEATURES Cuwireinterconnectforlowcost StandardJEDECpackageoutlines Multi-dieproductioncapability Turnkeytestservices,includingstriptestoptions Greenmaterialsarestandard–Pb-freeandRoHScompliant Stealthdicing(narrowsawstreets) Larger/Higherdensityleadframe

SOIC

Surface Mount SOIC Resistor Networks

SOIC

Both narrow and wide body versions available

SOIC-14PIN

14-Pin Surface Mount, Narrow Body

(S)SOICPackage 14-PinSurfaceMount,NarrowBody

SOIC-8

DUAL OPERATIONAL AMPLIFIERS

[AdvancedAnalogCircuits] GeneralDescription TheAZ4558consistsoftwohighperformanceoperationalamplifiers.TheICfeatureshighgain,highinputresistance,excellentchannelseparation,widerangeofoperatingvoltageandinternalfrequencycompensation.Itisspecificallysuitablefo

SOIC24

24-Lead Small Outline IC (SOIC) 0.300 Body Width

SOIC-4

SOIC-4 Package Dimensions

SOIC4_DIM

SOIC-4 Package Dimensions