ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based

FEATURES Cu wire interconnect for low cost Standard JEDEC package outlines Multi-die production capability Turnkey test services, including strip test options ExposedPad configuration for increased thermal efficiency Up to 60% improvement in Theta JA (compared to standard TSSOP or

文件：780.44 Kbytes 页数：3 Pages

amkor

安靠科技

Silver Wirebonding

KEY FEATURES Ag-Alloy wire is softer than Cu wire resulting in lower Al-Splash and lower risk of bond pad damage Ag-Alloy wire has a wide process window that improves manufacturability for devices with fragile bond pad structures

文件：411.98 Kbytes 页数：2 Pages

amkor

安靠科技

SOIC (Small Outline IC Package) is a leadframe based, plastic encapsulated package

FEATURES Cu wire interconnect for low cost Standard JEDEC package outlines Multi-die production capability Turnkey test services, including strip test options Green materials are standard – Pb-free and RoHS compliant Stealth dicing (narrow saw streets) Larger/Higher density leadframe

文件：505.84 Kbytes 页数：2 Pages

amkor

安靠科技

Surface Mount SOIC Resistor Networks

文件：429.18 Kbytes 页数：3 Pages

WELWYN

Both narrow and wide body versions available

文件：496.17 Kbytes 页数：4 Pages

TTELEC

丝印：SOIC；Package：T1812Q；TLV181x-Q1 and TLV182x-Q1 Family of 40 V Automotive Rail-to-Rail Input Comparators with Push-Pull or Open-Drain Output Options

1 Features • Qualified for automotive applications • AEC-Q100 qualified with the following results: – Device temperature grade 1: –40°C to 125°C ambient operating temperature range – Device HBM ESD classification level 2 – Device CDM ESD classification level C3 • Wide 2.4 V to 40 V supply r

文件：1.90423 Mbytes 页数：43 Pages

TI

德州仪器

丝印：SOIC；Package：T1822Q；TLV181x-Q1 and TLV182x-Q1 Family of 40 V Automotive Rail-to-Rail Input Comparators with Push-Pull or Open-Drain Output Options

1 Features • Qualified for automotive applications • AEC-Q100 qualified with the following results: – Device temperature grade 1: –40°C to 125°C ambient operating temperature range – Device HBM ESD classification level 2 – Device CDM ESD classification level C3 • Wide 2.4 V to 40 V supply r

文件：1.90423 Mbytes 页数：43 Pages

TI

德州仪器

丝印：SOIC；Package：HCS74Q；SN74HCS74-Q1 Automotive Schmitt-Trigger Input Dual D-Type Positive-Edge-Triggered Flip-Flops With Clear and Preset

文件：1.42704 Mbytes 页数：25 Pages

TI

德州仪器

14-Pin Surface Mount, Narrow Body

(S) SOIC Package 14-Pin Surface Mount, Narrow Body

文件：18.66 Kbytes 页数：1 Pages

IRF

DUAL OPERATIONAL AMPLIFIERS

[Advanced Analog Circuits] General Description The AZ4558 consists of two high performance operational amplifiers. The IC features high gain, high input resistance, excellent channel separation, wide range of operating voltage and internal frequency compensation. It is specifically suitable fo

文件：228.87 Kbytes 页数：8 Pages

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