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IRKT26/06A

ADD-A-pakTMGENVPowerModules

MechanicalDescription TheGenerationVofAdd-A-pakmodulecombinetheexcellentthermalperformanceobtainedbytheusageofDirectBondedCoppersubstratewithsuperiormechanicalruggedness,thankstotheinsertionofasolidCopperbaseplateatthebottomsideofthedevice. Features ■Hig

IRF

International Rectifier

IRKT26/06A

ADD-A-pak-TMGENVPowerModules

IRF

International Rectifier

SKB26/06

PowerBridgeRectifiers

SemikronSemikron International

赛米控丹佛斯

SKB26/06

PowerBridgeRectifiers

SemikronSemikron International

赛米控丹佛斯

SKDI26/06

3~phase

SemikronSemikron International

赛米控丹佛斯

VS-VSKH26/06

Lowthermalresistance

MECHANICALDESCRIPTION TheAAPGen7(TO-240AA),newgenerationofAPPmodule,combinestheexcellentthermalperformancesobtainedbytheusageofexposeddirectbondedcoppersubstrate,withadvancedcompactsimplepackagesolutionandsimplifiedinternalstructurewithminimizednumberofinte

VishayVishay Siliconix

威世科技威世科技半导体

VS-VSKL26/06

Lowthermalresistance

MECHANICALDESCRIPTION TheAAPGen7(TO-240AA),newgenerationofAPPmodule,combinestheexcellentthermalperformancesobtainedbytheusageofexposeddirectbondedcoppersubstrate,withadvancedcompactsimplepackagesolutionandsimplifiedinternalstructurewithminimizednumberofinte

VishayVishay Siliconix

威世科技威世科技半导体

VS-VSKN26/06

Lowthermalresistance

MECHANICALDESCRIPTION TheAAPGen7(TO-240AA),newgenerationofAPPmodule,combinestheexcellentthermalperformancesobtainedbytheusageofexposeddirectbondedcoppersubstrate,withadvancedcompactsimplepackagesolutionandsimplifiedinternalstructurewithminimizednumberofinte

VishayVishay Siliconix

威世科技威世科技半导体

VS-VSKT26/06

Lowthermalresistance

MECHANICALDESCRIPTION TheAAPGen7(TO-240AA),newgenerationofAPPmodule,combinestheexcellentthermalperformancesobtainedbytheusageofexposeddirectbondedcoppersubstrate,withadvancedcompactsimplepackagesolutionandsimplifiedinternalstructurewithminimizednumberofinte

VishayVishay Siliconix

威世科技威世科技半导体

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