SIM8950X数据手册SIMCom中文资料规格书

特性 Features

General features
SIM8950
•Quad-Band LTE-FDD B1/B3/B5/B8
•Five-Band LTE-TDD B34/B38/B39/B40/B41
•Dual-Band UMTS/HSDPA/HSPA+ B1/B8
•Dual-Band TD-SCDMA B34/B39
•EVDO/CDMA BC0
•Dual-Band GSM/GPRS/EDGE B3/B8

SIM8950E
• Five-Band LTE-FDD B1/3/5/7/8/20
• Third-Band LTE-TDD B38/B40/B41
• Quad-Band UMTS/HSDPA/HSPA+ B1/B2/B5/B8
• Quad-Band GSM/GPRS/EDGE B2/B3/B5/B8

•GPRS multi-slot class 12
•EDGE multi-slot class 12
•WIFI 2.4/5G 802.11a/b/g/n/ac up to 433Mbps
•BT2.1+EDR/3.0/4.2 LE
•Supply voltage range: 3.4 ~ 4.4 V
•Operation temperature: : -25℃ to +75℃
•Storage temperature : -40℃ to +90℃
•Dimension: 44.1*45.6*2.8mm
•Weight: 12.5g
•LTE FDD/TDD Rel-9 Cat4/Rel-10 Cat7
•UTMS
•HSPA+ DC-HSPA+,Rel-10
•TD-SCDMA HSDPA Cat. 15-SIM8950
•TD-SCDMA HSUPA Cat. 6-SIM8950
•GSM GSM R99,GPRS,EDGE
•GNSS gpsOne Gen 8C lite; GPS, BeiDou, GLONASS or Galileo;
• WIFI 2.4/5G 802.11a/b/g/n/ac up to 433Mbps-SIM8950E
• BT2.1+EDR/3.0/4.2 LE-SIM8950E


Specifications for Data transfer
•LTE-FDD/LTE-TDD
- Uplink up to 50Mbps,
- Downlink up to 150Mbps
•HSPA+
- Uplink up to 11 Mbps,
- Downlink up to 42 Mbps
•UMTS
- Uplink/Downlink up to 384Kbps
•TD-HSDPA/HSUPA
- Uplink up to 2.2 Mbps,
- Downlink up to 2.8 Mbps
•TD-SCDMA
- Uplink up to 128Kbps,
- Downlink up to 384Kbps
Other features
•2GB LPDDR3 RAM + 16GB eMMC flash
•Octa-core ARM cortex A53 2.0GHz
•Video 4K at 30fps, 1080p at 60 fps Encode (H.264/H.265/VP8) Decode(/H.264/H.265/VP8/VP9)
•GPU Andreno 506 650MHz, 3D graphics accelerator OpenCL2.0 FP, DX12, PenGL ES3.1+, AEP
•Web technologies V8 JavaScript Engine optimizations JPEG hardware decode acceleration IP and HTTP tuning Flash and video processor decode optimization
•Android7.x

Interfaces
•2 Camera (MIPI, 24MP)
•2 LCD (MIPI,FHD 1920X1200 @60fps) Capacitive panels via ext IC
•Analog Audio (Microphone, Headset, Handset)
•USB 2.0/3.0, OTG, type C
•UART
•I2C interface
•ADC 10bit
•Micro SD card interface
•Battery
•GPIO
•SPI
•RTC

Certifications
• ROHS(TBD)