SIM8950LH数据手册SIMCom中文资料规格书

特性 Features

General features
Quad-Band LTE-FDD B1/B3/B5/B8
• Five-Band LTE-TDD B34/B38/B39/B40/B41
• Dual-Band UMTS/HSDPA/HSPA+ B1/B8
• Dual-Band TD-SCDMA B34/B39
• EVDO/CDMA BC0
• Dual-Band GSM/GPRS/EDGE B3/B8
• GPRS multi-slot class 12
• EDGE multi-slot class 12
• WIFI 2.4/5G 802.11a/b/g/n/ac up to 433Mbps
• BT2.1+EDR/3.0/4.2 LE
• Supply voltage range: 3.4 ~ 4.4 V
• Operation temperature: : -25℃ to +75℃
• Storage temperature : -40℃ to +90℃
• Dimension: 44.1*45.6*2.8mm
• Weight: 12.5g
• LTE FDD/TDD Rel-9 Cat4/Rel-10 Cat7
• UTMS
• HSPA+ DC-HSPA+,Rel-10
• TD-SCDMA HSDPA Cat. 15
• TD-SCDMA HSUPA Cat. 6
• GSM GSM R99,GPRS,EDGE
• GNSS gpsOne Gen 8C lite; GPS, BeiDou, GLONASS or Galileo;


Specifications for Data transfer
• LTE-FDD/LTE-TDD- Uplink up to 50Mbps,- Downlink up to 150Mbps
• HSPA+- Uplink up to 11 Mbps,- Downlink up to 42 Mbps
• UMTS- Uplink/Downlink up to 384Kbps
• TD-HSDPA/HSUPA- Uplink up to 2.2 Mbps,- Downlink up to 2.8 Mbps
• TD-SCDMA- Uplink up to 128Kbps,- Downlink up to 384Kbps
Other features
•2GB LPDDR3 RAM + 16GB eMMC flash•Octa-core ARM cortex A53 1.8GHz
• 1080p at 60 fpsEncode (H.264/H.265/VP8)Decode(/H.264/H.265/VP8/VP9)•GPUAndreno 506 650MHz, 3D graphics acceleratorOpenCL2.0 FP, DX12, PenGL ES3.1+, AEP•Web technologiesV8 JavaScript Engine optimizationsJPEG hardware decode accelerationIP and HTTP tuningFlash and video processor decode optimization•Android7.x/8.x

Interfaces
• 2 Camera (MIPI, 21MP)
• 2 LCD (MIPI,FHD 1920X1200 @60fps)Capacitive panels via ext IC•Analog Audio (Microphone, Headset, Handset)
• USB 2.0/3.0, OTG, type C
• UART
• I2C interface
• ADC 10bit
• Micro SD card interface
• Battery
• GPIO
• SPI
• RTC

Certifications
• 3C