Rectifier Thyr./Diode Module

Rectifier Thyr./Diode Module Features • Terminal height 17 mm • Chips soldered directly to isolated substrate Typical Applications • Input Bridge Rectifier for AC/DC motor control • Power supply

文件：319.41 Kbytes 页数：4 Pages

Semikron

赛米控丹佛斯

Trench IGBT Modules

Features • Homogeneous Si • Trench = Trenchgate technology •VCE(sat)with positive temperature coefficient • UL recognised file no. E63532 Typical Applications* • Matrix Converter • Resonant Inverter • Current Source Inverter Remarks • Case temperature limited to T

文件：1.027339 Mbytes 页数：4 Pages

Semikron

赛米控丹佛斯

Trench IGBT Modules

Features • Homogeneous Si • Trench = Trenchgate technology • VCE(sat) with positive temperature coefficient Typical Applications • Matrix Converter • Resonant Inverter • Current Source Inverter

文件：858.98 Kbytes 页数：4 Pages

Semikron

赛米控丹佛斯

Trench IGBT Modules

Features • Homogeneous Si • Trench = Trenchgate technology • VCE(sat) with positive temperature coefficient • UL recognised file no. E63532 Typical Applications • Matrix Converter • Resonant Inverter • Current Source Inverter

文件：1.01512 Mbytes 页数：4 Pages

Semikron

赛米控丹佛斯

SPT IGBT Modules

Features • Homogeneous Si • SPT = Soft-Punch-Through technology • VCE(sat) with positive temperature coefficient • High short circuit capability Typical Applications • AC inverter drives • UPS • Electronic welders up to 20 kHz

文件：1.14407 Mbytes 页数：4 Pages

Semikron

赛米控丹佛斯

SPT IGBT Modules

Features • Homogeneous Si • SPT = Soft-Punch-Through technology • VCE(sat) with positive temperature coefficient • High short circuit capability • UL recognised file no. E63532 Typical Applications • AC inverter drives • UPS • Electronic welders up to 20 kHz

文件：1.21838 Mbytes 页数：4 Pages

Semikron

赛米控丹佛斯

SEMiX202GB12Vs

Features • Homogeneous Si • VCE(sat) with positive temperature coefficient • High short circuit capability • UL recognised file no. E63532 Typical Applications* • AC inverter drives • UPS • Electronic Welding

文件：162.33 Kbytes 页数：5 Pages

Semikron

赛米控丹佛斯

T-Type Bridge Rectifier

Features* • Solderless assembling solution with PressFIT signal pins and screw power terminals • IGBT 3 High Speed Trench Technology • Silicon Carbide (SiC) Free-wheeling Schottky diodes : Diode 1 (D1…D4) • Silicon anti-parallel diodes , Diode 2 (D5…D8) • VCE(sat) with positive temperatu

文件：670.66 Kbytes 页数：7 Pages

Semikron

赛米控丹佛斯

Trench IGBT Modules

Features* • Solderless assembly solution with PressFIT signal pins and screw power terminals • IGBT 4 Trench Gate Technology • VCE(sat) with positive temperature coefficient • Low inductance case • Reliable mechanical design with injection moulded terminals and robust internal connection

文件：591.03 Kbytes 页数：6 Pages

Semikron

赛米控丹佛斯

Trench IGBT Modules

Features* • Solderless assembly solution with pressFit signal pins and screw power terminals • Trench = Trenchgate technology • VCE(sat) with positive temperature coefficient • High overload capability • High short circuit capability • Low loss high density IGBTs • UL recognized, file no

文件：338.43 Kbytes 页数：6 Pages

Semikron

赛米控丹佛斯