positive temperature coefficient

Features • Homogeneous Si • VCE(sat) with positive temperature coefficient • High short circuit capability • UL recognised file no. E63532 Typical Applications* • AC inverter drives • UPS • Electronic Welding

文件：472.69 Kbytes 页数：5 Pages

Semikron

赛米控丹佛斯

Trench IGBT Modules

Features* • Press Fit • Homogeneous Si • Trench = Trenchgate technology • VCE(sat) with positive temperature coefficient • High short circuit capability • UL recognised file no. E63532 Typical Applications • AC inverter drives • UPS • Electronic Welding

文件：844.09 Kbytes 页数：6 Pages

Semikron

赛米控丹佛斯

Trench IGBT Modules

Features • Homogeneous Si • SPT = Through technology • VCE(sat) with positive temperature coefficient • High short circuit capability Typical Applications • AC inverter drives • UPS • Electronic Welders

文件：463.35 Kbytes 页数：5 Pages

Semikron

赛米控丹佛斯

Trench IGBT Modules

Features • Homogeneous Si • SPT = Through technology • VCE(sat) with positive temperature coefficient • High short circuit capability Typical Applications • AC inverter drives • UPS • Electronic Welders

文件：463.35 Kbytes 页数：5 Pages

Semikron

赛米控丹佛斯

Trench IGBT Modules

Features • Homogeneous Si • SPT = Through technology • VCE(sat) with positive temperature coefficient • High short circuit capability Typical Applications • AC inverter drives • UPS • Electronic Welders

文件：463.35 Kbytes 页数：5 Pages

Semikron

赛米控丹佛斯

SEMiX151GB17E4s

Features • Homogeneous Si • Trench = Trenchgate technology • VCE(sat) with positive temperature coefficient • High short circuit capability • UL recognized, file no. E63532 Typical Applications* • AC inverter drives • UPS • Electronic Welding

文件：260.85 Kbytes 页数：5 Pages

Semikron

赛米控丹佛斯

SPT IGBT Modules

Features • Homogeneous Si • SPT = Soft-Punch-Through technology • VCE(sat) with positive temperature coefficient • High short circuit capability • UL recognised file no. E63532 Typical Applications • AC inverter drives • UPS • Electronic welders up to 20 kHz

文件：335.5 Kbytes 页数：2 Pages

Semikron

赛米控丹佛斯

3-Level NPC IGBT-Module

Features • Solderless assembling solution with PressFIT signal pins and screw power terminals • IGBT 4 Trench Gate Technology • VCE(sat) with positive temperature coefficient • Low inductance case • Reliable mechanical design with injection moulded terminals and reliable internal connect

文件：867.72 Kbytes 页数：10 Pages

Semikron

赛米控丹佛斯

Trench IGBT Modules

Features* • Press Fit • Homogeneous Si • Trench = Trenchgate technology • VCE(sat) with positive temperature coefficient • High short circuit capability • UL recognised file no. E63532 Typical Applications • AC inverter drives • UPS • Electronic Welding

文件：847.62 Kbytes 页数：6 Pages

Semikron

赛米控丹佛斯

Rectifier Thyr./Diode Module

Rectifier Thyr./Diode Module Features • Terminal height 17 mm • Chips soldered directly to isolated substrate Typical Applications • Input Bridge Rectifier for AC/DC motor control • Power supply

文件：1.24875 Mbytes 页数：4 Pages

Semikron

赛米控丹佛斯