0.2A SCHOTTKY BARRIER DIODE CHIP SCALE PACKAGE

Description The SDM02U30CSP is a 30-Volt 0.2A Schottky Barrier Diode that is optimized for low forward voltage drop and low leakage current. It’s housed in a compact Chip Scale Package (CSP) that occupies only 0.18mm2 board space. The low thermal resistance enables designers to meet design challe

文件：480.34 Kbytes 页数：5 Pages

DIODES

美台半导体

0.2A SCHOTTKY BARRIER DIODE CHIP SCALE PACKAGE

Description The SDM02U30CSP is a 30-Volt 0.2A Schottky Barrier Diode that is optimized for low forward voltage drop and low leakage current. It’s housed in a compact Chip Scale Package (CSP) that occupies only 0.18mm2 board space. The low thermal resistance enables designers to meet design challe

文件：480.34 Kbytes 页数：5 Pages

DIODES

美台半导体

0.2 A SCHOTTKY BARRIER RECTIFER CHIP SCALE PACKAGE

The SDM02U30CSP is a 30 Volt 0.2A Schottky Barrier diode that is optimized for low forward voltage drop and low leakage current, housed in a compact chip scale package (CSP) that occupies only 0.18mm2 board space. The low thermal resistance enables designers to meet design challenges of increasing e 0.18mm2 Footprint, Off Board Profile of 0.28mm\nLow Forward Voltage of 0.50V (Max) – Minimizes Power Dissipation Losses\nLow Leakage – Maximizes Battery Power;

Diodes

美台半导体

Package：2-XDFN；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：分立半导体产品 二极管 - 整流器 - 单 描述：DIODE SCHOTTKY X3-WLB0603-2

DIODES

美台半导体