Silver Wirebonding

KEY FEATURES Ag-Alloy wire is softer than Cu wire resulting in lower Al-Splash and lower risk of bond pad damage Ag-Alloy wire has a wide process window that improves manufacturability for devices with fragile bond pad structures

文件：411.98 Kbytes 页数：2 Pages

amkor

安靠科技

The Stacked CSP family leverages Amkor’s industry-leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities.

FEATURES 2-21 mm body size Package height down to 0.5 mm High die count pure memory, eMMC, eMCP and MCP Design, assembly and test capabilities that enable stacking of DRAM with logic or flash memory devices Logic/Flash, digital/analog and other ASIC/memory combinations of 320 I/O and gre

文件：1.19761 Mbytes 页数：3 Pages

amkor

安靠科技

FAST RECOVERY HIGH CURRENT DOUBLER AND CENTER TAPS

文件：67.85 Kbytes 页数：2 Pages

SEMTECH

先之科

SUPERFAST HIGH CURRENT DOUBLER AND CENTER TAPS

文件：71.73 Kbytes 页数：2 Pages

SEMTECH

先之科

SUPERFAST HIGH CURRENT DOUBLER AND CENTER TAPS

文件：71.73 Kbytes 页数：2 Pages

SEMTECH

先之科

SUPERFAST HIGH CURRENT DOUBLER AND CENTER TAPS

文件：71.73 Kbytes 页数：2 Pages

SEMTECH

先之科

STANDARD RECOVERY HIGH CURRENT DOUBLER AND CENTER TAPS

文件：68.8 Kbytes 页数：2 Pages

SEMTECH

先之科

High Current, High Density, Standard Recovery Doubler and Center Taps

Semtech

先之科

High Current, High Density, Fast Recovery Doubler and Center Taps

Semtech

先之科

High Current, High Density, Fast Recovery Doubler and Center Taps

Semtech

先之科