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S12MSCANV2/D

The SoC Guide provides information about the MC9S12KG128 device made up of standard HCS12 blocks and the HCS12 processor core

Features HCS12 Core – 16-bit HCS12 CPU i. Upward compatible with M68HC11 instruction set ii. Interrupt stacking and programmer’s model identical to M68HC11 iii. Instruction queue iv. Enhanced indexed addressing System Integration Module (SIM) – MEBI (Multiplexed External Bus Interface) –

文件:1.03548 Mbytes 页数:98 Pages

恩XP

恩XP

S12MSCANV2/D

Device User Guide V01.18

Overview The MC9S12H256 microcontroller unit (MCU) is a 16-bit device composed of standard on-chip peripherals including a 16-bit central processing unit (HCS12 CPU), 256K bytes of Flash EEPROM, 12K bytes of RAM, 4K bytes of EEPROM, two asynchronous serial communications interfaces (SCI), a

文件:5.66869 Mbytes 页数:130 Pages

freescaleFreescale Semiconductor, Inc

飞思卡尔飞思卡尔半导体

S12MSCANV2D

MC9S12DT128 Device User Guide V02.09

Overview The MC9S12DT128 microcontroller unit (MCU) is a 16-bit device composed of standard on-chip peripherals including a 16-bit central processing unit (HCS12 CPU), 128K byt)es of Flash EEPROM, 8K bytes of RAM, 2K bytes of EEPROM, two asynchronous serial communications interfaces (SCI), two se

文件:2.08375 Mbytes 页数:138 Pages

Motorola

摩托罗拉

S12MSCANV2SLASHD

Device User Guide V01.18

Overview The MC9S12H256 microcontroller unit (MCU) is a 16-bit device composed of standard on-chip peripherals including a 16-bit central processing unit (HCS12 CPU), 256K bytes of Flash EEPROM, 12K bytes of RAM, 4K bytes of EEPROM, two asynchronous serial communications interfaces (SCI), a

文件:5.66869 Mbytes 页数:130 Pages

freescaleFreescale Semiconductor, Inc

飞思卡尔飞思卡尔半导体

S12MSCANV2SLASHD

The SoC Guide provides information about the MC9S12KG128 device made up of standard HCS12 blocks and the HCS12 processor core

Features HCS12 Core – 16-bit HCS12 CPU i. Upward compatible with M68HC11 instruction set ii. Interrupt stacking and programmer’s model identical to M68HC11 iii. Instruction queue iv. Enhanced indexed addressing System Integration Module (SIM) – MEBI (Multiplexed External Bus Interface) –

文件:1.03548 Mbytes 页数:98 Pages

恩XP

恩XP

S12MSCANV3

MC9S12XDP512 Device User Guide

Features HCS12X Core – 16-bit HCS12X CPU i. Upward compatible with MC9S12 instruction set ii. Interrupt stacking and programmer’s model identical to MC9S12 iii. Instruction queue iv. Enhanced indexed addressing v. Enhanced instruction set – EBI (External Bus Interface) – MMC (Module Mappi

文件:1.59943 Mbytes 页数:152 Pages

恩XP

恩XP

S12MSCANV3

MC9S12XDP512 Device User Guide

Features HCS12X Core – 16-bit HCS12X CPU i. Upward compatible with MC9S12 instruction set ii. Interrupt stacking and programmer’s model identical to MC9S12 iii. Instruction queue iv. Enhanced indexed addressing v. Enhanced instruction set – EBI (External Bus Interface) – MMC (Module Mappi

文件:2.00523 Mbytes 页数:176 Pages

恩XP

恩XP

S12MSCANV3D

MC9S12XDP512 Device User Guide

Features HCS12X Core – 16-bit HCS12X CPU i. Upward compatible with MC9S12 instruction set ii. Interrupt stacking and programmer’s model identical to MC9S12 iii. Instruction queue iv. Enhanced indexed addressing v. Enhanced instruction set – EBI (External Bus Interface) – MMC (Module Mappi

文件:1.59943 Mbytes 页数:152 Pages

恩XP

恩XP

S12MSCANV3D

MC9S12XDP512 Device User Guide

Features HCS12X Core – 16-bit HCS12X CPU i. Upward compatible with MC9S12 instruction set ii. Interrupt stacking and programmer’s model identical to MC9S12 iii. Instruction queue iv. Enhanced indexed addressing v. Enhanced instruction set – EBI (External Bus Interface) – MMC (Module Mappi

文件:2.00523 Mbytes 页数:176 Pages

恩XP

恩XP

S12MC

12A, 400V - 1000V Surface Mount Glass Passivated Rectifier

文件:289.18 Kbytes 页数:5 Pages

TSC

台湾半导体

产品属性

  • 产品编号:

    S12M

  • 制造商:

    GeneSiC Semiconductor

  • 类别:

    分立半导体产品 > 二极管 - 整流器 - 单

  • 包装:

    散装

  • 二极管类型:

    标准

  • 电流 - 平均整流 (Io):

    12A

  • 速度:

    标准恢复 >500ns,> 200mA(Io)

  • 安装类型:

    底座,接线柱安装

  • 封装/外壳:

    DO-203AA,DO-4,接线柱

  • 供应商器件封装:

    DO-4

  • 工作温度 - 结:

    -65°C ~ 175°C

  • 描述:

    DIODE GEN PURP 1000V 12A DO4

供应商型号品牌批号封装库存备注价格
GeneSiC
1935+
N/A
55
加我qq或微信,了解更多详细信息,体验一站式购物
询价
GENESIC
25+
DO-4
326
就找我吧!--邀您体验愉快问购元件!
询价
GeneSiC
22+
NA
55
加我QQ或微信咨询更多详细信息,
询价
24+
N/A
65000
一级代理-主营优势-实惠价格-不悔选择
询价
GeneSiC Semiconductor
25+
DO-4
9350
独立分销商 公司只做原装 诚心经营 免费试样正品保证
询价
GeneSiC
25+
电联咨询
7800
公司现货,提供拆样技术支持
询价
SHARP
00+
DIP6
4370
全新原装进口自己库存优势
询价
SHARP
10+
DIP-6
7800
全新原装正品,现货销售
询价
SHARP
04+
DIP-6
2000
询价
A
24+
b
100
询价
更多S12M供应商 更新时间2025-12-13 10:19:00