丝印：S12A；Package：TSSOP-8；EEPROM Serial 512-Kb SPI

文件：395.61 Kbytes 页数：20 Pages

ONSEMI

安森美半导体

丝印：S12A；Package：TSSOP-8；EEPROM Serial 512-Kb SPI

文件：395.61 Kbytes 页数：20 Pages

ONSEMI

安森美半导体

丝印：S12A45S；Package：POWERDI5；12A SBR® SUPER BARRIER RECTIFIER POWERDI®

Features Designed as Bypass Diodes for Solar Panels Selectively Rated for +200°C Maximum Junction Temperature for High Thermal Reliability Patented Super Barrier Rectifier Technology Low Forward Voltage Drop Excellent High Temperature Stability Lead Free Finish, RoHS Compliant (Notes 1 & 2)

文件：561.87 Kbytes 页数：5 Pages

DIODES

美台半导体

COMMERCIAL PHONE JACKS

1/4 PHONE JACKS

文件：152.43 Kbytes 页数：8 Pages

SWITCH

Device User Guide V01.18

Overview The MC9S12H256 microcontroller unit (MCU) is a 16-bit device composed of standard on-chip peripherals including a 16-bit central processing unit (HCS12 CPU), 256K bytes of Flash EEPROM, 12K bytes of RAM, 4K bytes of EEPROM, two asynchronous serial communications interfaces (SCI), a

文件：5.66869 Mbytes 页数：130 Pages

FREESCALEFreescale Semiconductor, Inc

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Device User Guide V01.18

Overview The MC9S12H256 microcontroller unit (MCU) is a 16-bit device composed of standard on-chip peripherals including a 16-bit central processing unit (HCS12 CPU), 256K bytes of Flash EEPROM, 12K bytes of RAM, 4K bytes of EEPROM, two asynchronous serial communications interfaces (SCI), a

文件：5.66869 Mbytes 页数：130 Pages

FREESCALEFreescale Semiconductor, Inc

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The SoC Guide provides information about the MC9S12KG128 device made up of standard HCS12 blocks and the HCS12 processor core

Features HCS12 Core – 16-bit HCS12 CPU i. Upward compatible with M68HC11 instruction set ii. Interrupt stacking and programmer’s model identical to M68HC11 iii. Instruction queue iv. Enhanced indexed addressing System Integration Module (SIM) – MEBI (Multiplexed External Bus Interface) –

文件：1.03548 Mbytes 页数：98 Pages

恩XP

The SoC Guide provides information about the MC9S12KG128 device made up of standard HCS12 blocks and the HCS12 processor core

Features HCS12 Core – 16-bit HCS12 CPU i. Upward compatible with M68HC11 instruction set ii. Interrupt stacking and programmer’s model identical to M68HC11 iii. Instruction queue iv. Enhanced indexed addressing System Integration Module (SIM) – MEBI (Multiplexed External Bus Interface) –

文件：1.03548 Mbytes 页数：98 Pages

恩XP

MC9S12XDP512 Device User Guide

Features HCS12X Core – 16-bit HCS12X CPU i. Upward compatible with MC9S12 instruction set ii. Interrupt stacking and programmer’s model identical to MC9S12 iii. Instruction queue iv. Enhanced indexed addressing v. Enhanced instruction set – EBI (External Bus Interface) – MMC (Module Mappi

文件：1.59943 Mbytes 页数：152 Pages

恩XP

MC9S12XDP512 Device User Guide

Features HCS12X Core – 16-bit HCS12X CPU i. Upward compatible with MC9S12 instruction set ii. Interrupt stacking and programmer’s model identical to MC9S12 iii. Instruction queue iv. Enhanced indexed addressing v. Enhanced instruction set – EBI (External Bus Interface) – MMC (Module Mappi

文件：2.00523 Mbytes 页数：176 Pages

恩XP