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ES1B-13-F

1.0ASURFACEMOUNTSUPER-FASTRECTIFIER

Features ●GlassPassivatedDieConstruction ●Super-FastRecoveryTimeforHighEfficiency ●SurgeOverloadRatingto30APeak ●IdeallySuitedforAutomatedAssembly ●LeadFreeFinish;RoHSCompliant(Notes1&2) ●HalogenandAntimonyFree“Green”Device(Note3)

DIODESDiodes Incorporated

美台半导体

RS1B-13-F

1.0ASURFACEMOUNTFASTRECOVERYRECTIFIER

Features •GlassPassivatedDieConstruction •FastRecoveryTimeForHighEfficiency •LowForwardVoltageDropandHighCurrentCapability •SurgeOverloadRatingto30APeak •IdeallySuitedforAutomatedAssembly •AvailableinLeadFreeFinish/RoHSCompliantVersion(Note4)

DIODESDiodes Incorporated

美台半导体

RS1B-13-F

1.0ASURFACEMOUNTFASTRECOVERYRECTIFIER

Features •GlassPassivatedDieConstruction •FastRecoveryTimeforHighEfficiency •SurgeOverloadRatingto30APeak •IdeallySuitedforAutomatedAssembly •Lead-FreeFinish;RoHSCompliant(Notes1&2) •HalogenandAntimonyFree.“Green”Device(Note3)

DIODESDiodes Incorporated

美台半导体

US1B-13-F

1.0ASURFACEMOUNTULTRA-FASTRECTIFIER

Features •GlassPassivatedDieConstruction •Ultra-FastRecoveryTimeforHighEfficiency •SurgeOverloadRatingto30APeak •HighCurrentCapability •IdeallySuitedforAutomatedAssembly •LeadFreeFinish/RoHSCompliant(Note1) •GreenMoldingCompound(NoHalogenandAntimony)(N

DIODESDiodes Incorporated

美台半导体

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