丝印：RS1J；Package：SMA；Fast Recovery Rectifier

FEATURES ● Low profile package ● For surface mounted applications ● Built-in strain relief, ideal for automated placement ● Plastic package has underwriters, laborator flammability classification 94V-0 ● High temperature soldering: 260°C/10 seconds at terminals MECHANICAL DATA ● Case :JEDEC

文件：486.96 Kbytes 页数：4 Pages

BILIN

银河微电

丝印：RS1K；Package：SMA；Fast Recovery Rectifier

FEATURES ● Low profile package ● For surface mounted applications ● Built-in strain relief, ideal for automated placement ● Plastic package has underwriters, laborator flammability classification 94V-0 ● High temperature soldering: 260°C/10 seconds at terminals MECHANICAL DATA ● Case :JEDEC

文件：487.55 Kbytes 页数：4 Pages

BILIN

银河微电

丝印：RS1K；Package：DO-214AC；Surface Mount Fast Recovery Rectifiers RS1A Through RS1M

Features Low profile package Ideal for automated placement Glass passivated chip junction High forward surge capability Fast reverse recovery time Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C TYPICAL APPLICATIONS For use in fast switching rectification of powe

文件：1.01636 Mbytes 页数：3 Pages

RFE

RFE international

丝印：RS1K；Package：SMA；Fast Rectifiers

Features • Glass−Passivated Junction • For Surface Mounted Applications • Built−in Strain Relief, Ideal for Automated Placement • UL Certified: Certificate # E326243 • These Devices are Pb−Free and are RoHS Compliant

文件：253.47 Kbytes 页数：5 Pages

ONSEMI

安森美半导体

丝印：RS1K；Package：DO-214AC；Surface Mount Fast Recovery Rectifiers

Features ● Low profile package ● Ideal for automated placement ● Glass passivated chip junction ● Fast switching for high efficiency ● High forward surage capability ● High temperatrue soldering: 260ć/10 seconds at terminals ● Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC

文件：474.49 Kbytes 页数：3 Pages

YFWDIODE

佑风微

丝印：RS1K；Package：DO-214AC；Surface Mount Fast Recovery Rectifiers

Features For surface mounted applications Low profile package Fast reverse recovery time Lead free in comply with EU RoHS 2011/65/EU directives Glass passivated chip junction Easy to pick and place

文件：2.26715 Mbytes 页数：4 Pages

UNSEMI

优恩半导体

丝印：RS1K；Package：DO-214AC；1.0A SURFACE MOUNT GLASS PASSIVATED FAST RECOVERY DIODE

Features  Glass Passivated Die Construction  Ideally Suited for Automatic Assembly  Low Forward Voltage Drop, High Efficiency  Surge Overload Rating to 30A Peak  Low Power Loss  Fast Recovery Time  Plastic Case Material has UL Flammability Classification Rating 94V-0

文件：43.04 Kbytes 页数：4 Pages

WTE

Won-Top Electronics

丝印：RS1L180GN；Package：HSOP8；Nch 60V 68A Power MOSFET

Features 1) Low on - resistance 2) High power package (HSOP8) 3) Pb-free plating ; RoHS compliant 4) Halogen free 5) 100 Rg and UIS tested Application Switching

文件：2.74241 Mbytes 页数：13 Pages

ROHM

罗姆

丝印：RS1M；Package：DO-214AC；Surface Mount Fast Recovery Rectifiers RS1A Through RS1M

Features Low profile package Ideal for automated placement Glass passivated chip junction High forward surge capability Fast reverse recovery time Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C TYPICAL APPLICATIONS For use in fast switching rectification of powe

文件：1.01636 Mbytes 页数：3 Pages

RFE

RFE international

丝印：RS1M；Package：DO-214AC；Surface Mount Fast Recovery Rectifiers

Features ● Low profile package ● Ideal for automated placement ● Glass passivated chip junction ● Fast switching for high efficiency ● High forward surage capability ● High temperatrue soldering: 260ć/10 seconds at terminals ● Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC

文件：474.49 Kbytes 页数：3 Pages

YFWDIODE

佑风微