首页 >RL1N4003-T>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
GeneralPurposePlasticRectifier ReverseVoltage50to1000V ForwardCurrent1.0A Features •PlasticpackagehasUnderwritersLaboratoriesFlammabilityClassification94V-0 •Constructionutilizesvoid-freemoldedplastictechnique •Lowreverseleakage •Highforwardsurgecapability •Hightemperaturesolderingguarant | WINGSWing Shing Computer Components 永盛电子永盛电子(香港)有限公司 | WINGS | ||
Standardsiliconrectifierdiodes ForwardCurrent:1A ReverseVoltage:50to1300V Features •Max.soldertmeperature:260°C •PlasticmaterialhasULclassification94V-0 | SemikronSemikron International 赛米控丹佛斯 | Semikron | ||
1.0AMPSILICONRECTIFIERS VOLTAGERANGE50to1000Volts CURRENT1.0Ampere FEATURES *Lowforwardvoltagedrop *Highcurrentcapability *Highreliability *Highsurgecurrentcapability | BYTES Bytes | BYTES | ||
1.0AGLASSPASSIVATEDRECTIFIER Features •GlassPassivatedDieConstruction •HighCurrentCapabilityandLowForwardVoltageDrop •SurgeOverloadRatingto30APeak •LeadFreeFinish,RoHSCompliant(Note4) | DIODESDiodes Incorporated 美台半导体 | DIODES | ||
TECHNICALSPECIFICATIONSOFSILICONRECTIFIER VOLTAGERANGE-50to1000VoltsCURRENT-1.0Ampere FEATURES *Lowcost *Lowleakage *Lowforwardvoltagedrop *Highcurrentcapability | DCCOM Dc Components | DCCOM | ||
GENERALPURPOSEPLASTICRECTIFIER FEATURES •TheplasticpackagecarriesUnderwritesLaboratoryFlammabilityClassification94V-0 •Constructionutilizesvoid-freemoldedplastictechnique •Lowreverseleakage •Highforwardsurgecurrentcapability •Hightemperaturesolderingguaranteed:250°C/10seconds,0.375(9.5mm)lead | CHENYIShanghai Lunsure Electronic Tech 商朗电子上海商朗电子科技有限公司 | CHENYI | ||
PLASTICSILICONRECTIFIER(VOLTAGE-50to1000VoltsCURRENT-1.0Ampere) Features 1.Lowforwardvoltagedrop 2.Highcurrentcapability 3.Highreliability 4.Highsurgecurrentcapability | PANJITPan Jit International Inc. 強茂強茂股份有限公司 | PANJIT | ||
1.0AMPSILICONRECTIFIERS VOLTAGERANGE50to1000Volts CURRENT1.0Ampere | Surge Surge Components | Surge | ||
Rectifiers(Ruggedglasspackage,usingahightemperaturealloyedconstruction) DESCRIPTION Ruggedglasspackage,usingahightemperaturealloyedconstruction.Thispackageishermeticallysealedandfatiguefreeascoefficientsofexpansionofallusedpartsarematched. FEATURES •Glasspassivated •Highmaximumoperatingtemperature •Lowleakagecurrent •Excellent | PhilipsPhilips Semiconductors 飞利浦荷兰皇家飞利浦 | Philips | ||
PLASTICSILICONRECTIFIERS
| SEMTECHSemtech Corporation 升特 | SEMTECH |
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