REG0230F数据表ic资料供应价格典琦COMCHIP-114ic电子网

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零件编号	下载&订购	功能描述	制造商&上传企业	LOGO
ACDBQC0230R-HF	文件：477.22 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. -AEC-Q101Qualified.	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
ACDBUC0230-HF	文件：102 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
ALN0230	文件：214.78 Kbytes Page：3 Pages	InternallyMatchedLNAModule	ASB Advanced Semiconductor Business Inc.	ASB
ALN0230	文件：396.64 Kbytes Page：3 Pages	InternallyMatchedLNAModule	ASB Advanced Semiconductor Business Inc.	ASB
AR0230	文件：959.34 Kbytes Page：36 Pages	FullHDDigitalImageSensor	ONSEMION Semiconductor 安森美半导体安森美半导体公司	ONSEMI
AR0230CS	文件：864.75 Kbytes Page：33 Pages	1/2.7-Inch2.1Mp/FullHDDigitalImageSensor	ONSEMION Semiconductor 安森美半导体安森美半导体公司	ONSEMI
AR0230CS	文件：181.11 Kbytes Page：24 Pages	1/2.7?릋nch2.1Mp/FullHDDigitalImageSensor	ONSEMION Semiconductor 安森美半导体安森美半导体公司	ONSEMI
ASB0230	文件：143.43 Kbytes Page：3 Pages	SMDSchottkyBarrierDiode Features IO=200mA VR=30V -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowdrop-downvoltage. -Majoritycarrierconduction -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated,sold	ANACHIP 易亨易亨电子股份有限公司	ANACHIP
B0230D	文件：1.19922 Mbytes Page：4 Pages	N-ChannelMOSFETusesadvancedtrenchtechnology	DOINGTERSHENZHEN DOINGTER SEMICONDUCTOR CO., LTD. 杜因特深圳市杜因特半导体有限公司	DOINGTER
CDBER0230L	文件：203.05 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBER0230L-HF	文件：203.23 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBER0230R	文件：201.49 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBER0230R-HF	文件：201.77 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBERT0230R	文件：130.84 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0230	文件：65.65 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0230-HF	文件：200.87 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA RoHSDevice HalogenFree VR=30Volts Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. -Lowdrop-downvoltage. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplat	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0230L	文件：124 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features LowforwardVoltage Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:SOD-323F(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMI	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0230L-HF	文件：152.4 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Halogenfree. Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackagemoldedplastic. Terminals:Goldplated,sol	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0230R	文件：124.43 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features LowforwardVoltage Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:SOD-323F(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMI	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0230R-HF	文件：201.22 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Halogenfree. Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solde	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP

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供应商	型号	品牌	批号	封装	库存	备注	价格
深圳市华斯顿科技有限公司	REG0230F	TOSHIBA	22+23+	New	31469	绝对原装正品现货,全新深圳原装进口现货	询价
深圳市一线半导体有限公司	REG03GP				5000	公司存货	询价
艾睿国际（香港）有限公司	REG0412	BB	2021+	SOP8	100500	一级代理专营品牌!原装正品,优势现货,长期排单到货	询价
深圳市易讯博科技有限公司	REG-100	Eaton	22+	NA	168	加我QQ或微信咨询更多详细信息,	询价
深圳市恒科翔业电子有限公司	REG101	TI德州仪器	22+		24000	原装正品现货,实单可谈,量大价优	询价
深圳市汇莱威科技有限公司	REG101	TI		SOIC\|8	279100	16余年资质绝对原盒原盘更多数量	询价
深圳市中亿伟业电子有限公司	REG101	TI/德州	2018+	SO	32500	SOIC	询价
深圳市高捷芯城科技有限公司	REG101	TI(德州仪器)	23+	NA/	7350	现货供应,当天可交货!免费送样,原厂技术支持!!!	询价
上海磐岳电子有限公司	REG101-2.5	TI	2023+	SOT23-5	5800	进口原装,现货热卖	询价
深圳市凯斯宇科技有限公司	REG101285	BB	2022	SOP-8	5280	原厂原装正品,价格超越代理	询价

更多REG0230F供应商更新时间2024-6-21 16:50:00

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