Introduction

This document contains the specifications for the Intel® Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device. C3 SCSP memory solutions are offered in the following combinations:

• 32-Mbit flash + 8-Mbit SRAM

• 32-Mbit flash + 4-Mbit SRAM

• 16-Mbit flash + 4-Mbit SRAM

• 16-Mbit flash memory + 2-Mbit SRAM

Product Overview

The C3 SCSP device combines flash memory and SRAM into a single package, which provides secure low-voltage memory solutions for portable applications.

The flash memory provides the following features:

• Enhanced security.

• Instant locking/unlocking of any flash block with zero-latency

• A 128-bit protection register that enables unique device identification,

to meet the needs ofnext generation portable applications.

• Improved 12 V production programming for increased factory throughput.

Product Features

■ Flash Memory Plus SRAM

—Reduces Memory Board Space

Required, Simplifying PCB Design

Complexity

■ SCSP Technology

—Smallest Memory Subsystem Footprint

—Area : 8 x 10 mm for 16 Mbit (0.13 µm)

Flash + 2 Mbit or 4 Mbit SRAM

—Area : 8 x 12 mm for 32 Mbit (0.13 µm)

Flash + 4 Mbit or 8 Mbit SRAM

—Height : 1.20 mm for 16 Mbit (0.13 µm)

Flash + 2 Mbit or 4 Mbit SRAM, and 32

Mbit (0.13um) Flash + 8 Mbit SRAM

—Height : 1.40 mm for 32 Mbit (0.13 µm)

Flash + 4 Mbit SRAM

—This Family also includes 0.25 µm, 0.18

µm, and 0.13 µm technologies

■ Advanced SRAM Technology

—70 ns Access Time

—Low Power Operation

—Low Voltage Data Retention Mode

■ Intel® Flash Data Integrator (FDI) Software

—Real-Time Data Storage and Code

Execution in the Same Memory Device

—Full Flash File Manager Capability

■ Advanced+ Boot Block Flash Memory

—70 ns Access Time

—Instant, Individual Block Locking

—128 bit Protection Register

—12 V Production Programming

—Fast Program and Erase Suspend

—Extended Temperature –25 °C to +85 °C

■ Blocking Architecture

—Block Sizes for Code + Data Storage

—4-Kword Parameter Blocks

—64-Kbyte Main Blocks

—100,000 Erase Cycles per Block

■ Low Power Operation

—Asynchronous Read Current: 9 mA (Flash)

—Standby Current: 7 µA (Flash)

—Automatic Power Saving Mode

■ Flash Technologies

—0.25 µm ETOX™ VI, 0.18 µm ETOX™

VII and 0.13 µm ETOX™ VIII Flash

Technologies

RD38F1020C0ZTL0属于集成电路（IC） > 存储器。英特尔（集成电子公司）制造生产的RD38F1020C0ZTL0存储器存储器是集成电路上用作数据存储设备的半导体器件。这些器件分为非易失性或易失性两种，格式包括 CBRAM、DRAM、EEPROM、EERAM、EPROM、闪存、FRAM、NVSRAM、PCM (PRAM)、PSRAM、RAM 和 SRAM。这些器件的存储容量为 64 b 至 6 Tb 不等，接口有 I2C、MMC、并行、eMMC、串行、单线、SPI、UFS、Xccela 总线和 1-线。