丝印：RB3；Package：SOT-23；PROGRAMMABLE PRECISION REFERENCE

文件：831.73 Kbytes 页数：5 Pages

LEIDITECH

雷卯电子

Thermal Gap Filler

PRODUCT DESCRIPTION Tflex™ RB300 is an exceptionally soft gap filler pad with a thermal conductivity of 1.2 W/mK. Tflex RB300 is specially formulation to minimize the amount of silicone oil bleed in sensitive applications. Tflex™ RB300, in achieving its stellar compliancy, does not sacrifice t

文件：183.12 Kbytes 页数：2 Pages

LSTD

RB301S Thru RB309S

FEATURES • Plastic Package has Underwriters Laboratory Flammability Classification 94V-0 • Glass passivated chip junctions • Single in-line package • High current capacity with small package • Superior thermal conductivity • High temperature soldering guaranted: 260℃/10 seconds • High IFSM

文件：53.75 Kbytes 页数：2 Pages

LRC

乐山无线电

RB301S Thru RB309S

FEATURES • Plastic Package has Underwriters Laboratory Flammability Classification 94V-0 • Glass passivated chip junctions • Single in-line package • High current capacity with small package • Superior thermal conductivity • High temperature soldering guaranted: 260℃/10 seconds • High IFSM

文件：53.75 Kbytes 页数：2 Pages

LRC

乐山无线电

Radial Bobbin Inductors

文件：839.65 Kbytes 页数：1 Pages

ALLIED

Radial Bobbin Inductors

文件：839.65 Kbytes 页数：1 Pages

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Radial Bobbin Inductors

文件：836.21 Kbytes 页数：1 Pages

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Radial Bobbin Inductors

文件：839.65 Kbytes 页数：1 Pages

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Radial Bobbin Inductors

文件：836.21 Kbytes 页数：1 Pages

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Radial Bobbin Inductors

文件：839.65 Kbytes 页数：1 Pages

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