QSOP

SSOP (Shrink Small-Outline Package) and QSOP (Quarter-Size Small Outline Package) are leadframe based, plastic encapsulated packages

FEATURES Cuwireinterconnectforlowcost StandardJEDECpackageoutlines Multi-dieproductioncapability Turnkeytestservices,includingstriptestoptions Greenmaterialsarestandard–Pb-freeandRoHScompliant Stealthdicing(narrowsawstreets) Larger/Higherdensityleadframe

QSOP

Shrink Small Outline, Quarter-Size Small-Outline Packages

QSOP

RoHS compliant and Sn/Pb terminations available

QSOP-C

QSOP Thin Film on Ceramic Resistor Networks

Features: •Precisionratiotolerancesto±0.05% •TrackingTCRto±5ppm/°C •Reliable,nointernalcavity •StandardJEDEC16,20&24pinpackages •Ultra-stableTaNresistorsonceramicsubstrate •Lowercrosstalkthansiliconsubstratetypes

QSOP-16

SUGGESTED PAD LAYOUT

QSOP-20

SUGGESTED PAD LAYOUT

QSOP-24

Package MQA24