SSOP (Shrink Small-Outline Package) and QSOP (Quarter-Size Small Outline Package) are leadframe based, plastic encapsulated packages

FEATURES Cu wire interconnect for low cost Standard JEDEC package outlines Multi-die production capability Turnkey test services, including strip test options Green materials are standard – Pb-free and RoHS compliant Stealth dicing (narrow saw streets) Larger/Higher density leadframe

文件：475.9 Kbytes 页数：2 Pages

amkor

安靠科技

RoHS compliant and Sn/Pb terminations available

文件：442.95 Kbytes 页数：4 Pages

TTELEC

Shrink Small Outline, Quarter-Size Small-Outline Packages

文件：433.21 Kbytes 页数：2 Pages

amkor

安靠科技

QSOP Thin Film on Ceramic Resistor Networks

Features: • Precision ratio tolerances to ±0.05% • Tracking TCR to ±5ppm/°C • Reliable, no internal cavity • Standard JEDEC 16, 20 & 24 pin packages • Ultra-stable TaN resistors on ceramic substrate • Lower crosstalk than silicon substrate types

文件：547.5 Kbytes 页数：3 Pages

TTELEC

SUGGESTED PAD LAYOUT

文件：404.18 Kbytes 页数：27 Pages

DIODES

美台半导体

SUGGESTED PAD LAYOUT

文件：404.18 Kbytes 页数：27 Pages

DIODES

美台半导体

Package MQA24

文件：78.96 Kbytes 页数：1 Pages

Fairchild

仙童半导体

RoHS compliant and Sn/Pb terminations available

TT Electronics

SUGGESTED PAD LAYOUT

Diodes

美台半导体