QCC5124 SoC数据手册Qualcomm中文资料规格书

描述 Description

The Qualcomm® QCC5124 System-on-Chip (SoC) is designed to meet demand for robust, high quality, wireless Bluetooth listening experiences in small devices with low power consumption for longer audio playback.

QCC5124 architecture Is engineered for high performance with low power consumption. Power consumption can be reduced by up to 65 percent compared to our previous technology, for both voice calls and music streaming and devices are optimized to support longer audio playback in virtually all operating modes.

The flexibility provided by the programmable applications processor and audio DSPs helps manufacturers to easily differentiate products with new features without extended development cycles. QCC5124 is designed to support voice assistants through cloud services.

QCC5124 features digital active noise cancelling (ANC) technology integrated in the SoC, designed to eliminate the need for an external ANC solution. With Qualcomm TrueWireless™ technology, QCC5124 is engineered to deliver improved robustness and more evenly balanced power distribution between both earbuds, supporting longer playback time.

QC5124 is a part of the QCC5100 Low Power Bluetooth Audio SoC Series.

特性 Features

• Extremely low power design
• Bluetooth 5 radio
• 2Mbps Bluetooth low energy (LE) support
• Ultra-small form factor
• Powerful quad-core processor* architecture
• Dual core 32-bit processor application subsystem
• Dual core Qualcomm® Kalimba™ DSP Audio subsystem
• Embedded ROM + RAM and external Q-SPI Flash
• High performance low power audio
• 2-ch 98dBA headset class D
• 2-ch 99dBA line inputs (single ended)
• 192kHz 24-bit I2S & SPDIF interfaces
• Comprehensively programmable digital ANC
• Digital assistant ready
• Flexible software platform with powerful new IDE support
• aptX, aptX HD and aptX Adaptive support
• Support for Qualcomm TrueWireless Stereo and Qualcomm TrueWireless Stereo Plus
• Integrated battery charger supporting internal mode (up to 200 mA) and external mode (up to 1.8 A)
• Designed for reduced eBoM through highly integrated SoC design