丝印：Q6；Package：X1-DFN1006-2；24V ULTRA LOW CAPACITANCE BIDIRECTIONAL TVS DIODE

Features  Low Profile Package (0.53mm Max) and Ultra-Small PCB Footprint Area (1.08mm * 0.68mm Max) Suitable for Compact Portable Electronics  Provides ESD Protection per IEC 61000-4-2 Standard: Air ±15kV, Contact ±12kV  1 Channel of ESD Protection  Low Channel Input Capacitance  Tota

文件：430 Kbytes 页数：5 Pages

DIODES

美台半导体

丝印：Q6；Package：DFN1412D-3；Low capacitance bidirectional dual line ESD protection diode

1. General description ESD protection device in an ultra small DFN1412D-3 (SOT8009) leadless Surface-Mounted Device (SMD) plastic package with side wettable flanks, designed to protect two lines from the damage caused by ElectroStatic Discharge (ESD) and other transients. 2. Features and ben

文件：240.67 Kbytes 页数：11 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

丝印：Q6；Package：SOT23；20 V, P-channel Trench MOSFET

1. General description P-channel enhancement mode Field-Effect Transistor (FET) in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. 2. Features and benefits • Low threshold voltage • Extended temperature range Tj = 175 °C • Very fast swi

文件：297.59 Kbytes 页数：15 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

丝印：Q6；Package：DFN1006BD-2；Zener voltage regulator diodes

1. General description General-purpose Zener diodes in an ultra small SOD882BD (DFN1006BD-2) leadless Surface Mounted Device (SMD) plastic package with side-wettable flanks. 2. Features and benefits • Leadless ultra small plastic package with side-wettable flanks suitable for surface-mounted

文件：296.87 Kbytes 页数：13 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

丝印：Q64FVY；Package：BY；3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

FEATURES  Family of SpiFlash Memories – W25Q64FV: 64M-bit / 8M-byte (8,388,608) – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – QPI: CLK, /CS, IO0, IO1, IO2, IO3  Highest Performance Serial Flash – 104MHz

文件：1.91966 Mbytes 页数：92 Pages

WINBOND

华邦电子

丝印：Q64FVXGIQ；Package：XG；3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

FEATURES  Family of SpiFlash Memories – W25Q64FV: 64M-bit / 8M-byte (8,388,608) – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – QPI: CLK, /CS, IO0, IO1, IO2, IO3  Highest Performance Serial Flash – 104MHz

文件：1.91966 Mbytes 页数：92 Pages

WINBOND

华邦电子

丝印：Q60P05141；Package：SOP-8；P-Channel Enhancement Mode Power MOSFET

文件：460.68 Kbytes 页数：4 Pages

FS

丝印：Q6601；Package：SOP8；P-channel and N-channel Complementary MOSFETS

文件：480.35 Kbytes 页数：5 Pages

FS

丝印：Q6146QAAS；Package：VQFN-HR；LMQ61460-Q1 Automotive 3-V to 36-V, 6 A, Low EMI Synchronous Step-Down Converter

文件：4.01812 Mbytes 页数：52 Pages

TI

德州仪器

丝印：Q61460AAS；Package：VQFN-HR；LMQ61460 3-V to 36-V, 6 A, Low EMI Synchronous Step-Down Quiet Converter

文件：4.16613 Mbytes 页数：55 Pages

TI

德州仪器