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PGSMBA43CA

Low profile package

FEATURES • Low profile package • Ideal for automated placement • Glass passivated chip junction • Available in uni-directional and bi-directional • 600 W peak pulse power capability with a 10/1000 μs waveform, repetitive rate (duty cycle): 0.01 % • Excellent clamping capability • Very

文件:615.85 Kbytes 页数:4 Pages

UMW

友台半导体

PGSMBB2A

Low profile package

FEATURES • Low profile package • Ideal for automated placement • Glass passivated chip junction • Available in uni-directional and bi-directional • 600 W peak pulse power capability with a 10/1000 μs waveform, repetitive rate (duty cycle): 0.01 % • Excellent clamping capability • Very

文件:615.85 Kbytes 页数:4 Pages

UMW

友台半导体

PGSMBB2CA

Low profile package

FEATURES • Low profile package • Ideal for automated placement • Glass passivated chip junction • Available in uni-directional and bi-directional • 600 W peak pulse power capability with a 10/1000 μs waveform, repetitive rate (duty cycle): 0.01 % • Excellent clamping capability • Very

文件:615.85 Kbytes 页数:4 Pages

UMW

友台半导体

PGSMBE2A

Low profile package

FEATURES • Low profile package • Ideal for automated placement • Glass passivated chip junction • Available in uni-directional and bi-directional • 600 W peak pulse power capability with a 10/1000 μs waveform, repetitive rate (duty cycle): 0.01 % • Excellent clamping capability • Very

文件:615.85 Kbytes 页数:4 Pages

UMW

友台半导体

PGSMBE2CA

Low profile package

FEATURES • Low profile package • Ideal for automated placement • Glass passivated chip junction • Available in uni-directional and bi-directional • 600 W peak pulse power capability with a 10/1000 μs waveform, repetitive rate (duty cycle): 0.01 % • Excellent clamping capability • Very

文件:615.85 Kbytes 页数:4 Pages

UMW

友台半导体

PGSMBGBA

Low profile package

FEATURES • Low profile package • Ideal for automated placement • Glass passivated chip junction • Available in uni-directional and bi-directional • 600 W peak pulse power capability with a 10/1000 μs waveform, repetitive rate (duty cycle): 0.01 % • Excellent clamping capability • Very

文件:615.85 Kbytes 页数:4 Pages

UMW

友台半导体

PGSMBGBCA

Low profile package

FEATURES • Low profile package • Ideal for automated placement • Glass passivated chip junction • Available in uni-directional and bi-directional • 600 W peak pulse power capability with a 10/1000 μs waveform, repetitive rate (duty cycle): 0.01 % • Excellent clamping capability • Very

文件:615.85 Kbytes 页数:4 Pages

UMW

友台半导体

PGS010-2000-0

MMCmicro Card Reader - Push/Push (Top Mount)

文件:88.7 Kbytes 页数:1 Pages

YAMAICHI

PGS2K

Electrical Accessories Grounding

文件:208.53 Kbytes 页数:2 Pages

NVENT

PGS4K

Electrical Accessories Grounding

文件:208.53 Kbytes 页数:2 Pages

NVENT

技术参数

  • 工艺:

    单N

  • 沟道类型:

  • 防静电ESD:

    80

  • 漏源耐压Vds(V):

    20.000

  • 栅源耐压Vgs(V):

    1.8

  • 阈值电压Vth(V)TYP:

    16.000

  • 电流ID(A):

    8.000

  • 导通电阻Rds (on) (mΩ max) at Vgs=10V:

    10.000

  • 导通电阻Rds (on) (mΩ max) at Vgs=4.5V:

    0.000

  • 导通电阻Rds (on) (mΩ max) at Vgs=1.8V:

    0.000

  • 规格书:

    0.000

供应商型号品牌批号封装库存备注价格
Richco
11
全新原装 货期两周
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QIMONDA
25+23+
BGA655
45744
绝对原装正品现货,全新深圳原装进口现货
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YAMAICH
25+
5800
百分百原装正品 真实公司现货库存 本公司只做原装 可
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Richco
2022+
7
全新原装 货期两周
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RICHCO
23+
NA
12730
原装正品代理渠道价格优势
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RICHCO
2011+
1000
普通
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Hoffman
2020+
N/A
8
加我qq或微信,了解更多详细信息,体验一站式购物
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RIC
2447
SMD
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
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YAMAICHI
25+
Connector
10000
就找我吧!--邀您体验愉快问购元件!
询价
SCUTUM
23+
TSOP
50000
全新原装正品现货,支持订货
询价
更多PGS供应商 更新时间2025-10-7 16:06:00