首页 >NDS0001E-LF>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
QSFPDDCableAssemblies FEATURES §Configurable&flexible §Backwardsplugcapabilityto100G;seamlesstransitionto futurehigheraggregatebandwidth §OptimizedPCBinterfaceboardwithautosolderingprocess §Assembledwithindustryleadingtwin-axialSKEWCLEAR® 8-pairor16-pairwire §EEPROMincableassem | AMPHENOLAmphenol Corporation 安费诺集团美国安费诺集团 | AMPHENOL | ||
QSFPDDCableAssemblies FEATURES §Configurable&flexible §Backwardsplugcapabilityto100G;seamlesstransitionto futurehigheraggregatebandwidth §OptimizedPCBinterfaceboardwithautosolderingprocess §Assembledwithindustryleadingtwin-axialSKEWCLEAR® 8-pairor16-pairwire §EEPROMincableassem | AMPHENOLAmphenol Corporation 安费诺集团美国安费诺集团 | AMPHENOL | ||
QSFPDDCableAssemblies FEATURES §Configurable&flexible §Backwardsplugcapabilityto100G;seamlesstransitionto futurehigheraggregatebandwidth §OptimizedPCBinterfaceboardwithautosolderingprocess §Assembledwithindustryleadingtwin-axialSKEWCLEAR® 8-pairor16-pairwire §EEPROMincableassem | AMPHENOLAmphenol Corporation 安费诺集团美国安费诺集团 | AMPHENOL | ||
NPAKTankvalveblock,aluminum | RALSTON Ralston Instruments. | RALSTON | ||
10BASE-TISOLATIONMODULESINPCMCIAPACKAGE Feature ●StandardlowprofilePCMCIApackage. ●LdealforTypeIorTypeIIapplications. ●TransfermoldedSMDpackage. ●Pickandplacecompatible. ●DesignedtowithstandIRreflowsoldering. ●Supportmost10Base-Ttransceiverchips. ●Operationtemperaturerange:0℃to+70℃. ●Storag | BOTHHAND Bothhand USA | BOTHHAND | ||
Solid-StateRelays | TTELECTT Electronics. TT电子公司梯梯电子集成制造服务(苏州)有限公司 | TTELEC | ||
TheProductDataAmendmentseriesofdocuments | CMLMICRO CML Microcircuits | CMLMICRO | ||
EN60320-1StandardSheetC14ClassIColdCondition(Fused) | BULGIN BULGIN COMPONENTS PLC | BULGIN | ||
EN60320-1StandardSheetC14ClassIColdCondition(Fused) | BULGIN BULGIN COMPONENTS PLC | BULGIN | ||
EN60320-1StandardSheetC14ClassIColdCondition(Fused) | BULGIN BULGIN COMPONENTS PLC | BULGIN |
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