首页 >MURD560S-TP>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
Lowforwardvoltage,highcurrentcapability | DYELECDIYI Electronic Technology Co., Ltd. 迪一电子山东迪一电子科技有限公司 | DYELEC | ||
ULTRAFASTPLASTICRECTIFIER | SMCSangdest Microelectronic (Nanjing) Co., Ltd 烧结金属 | SMC | ||
GLASSPASSIVATEDSUPERFASTRECTIFIER | JINGHENGJinan Jing Heng Electronics Co., Ltd. 晶恒济南晶恒电子有限责任公司 | JINGHENG | ||
SUPERFASTRECTIFIERS FEATURES Metal-Semiconductorjunctionwithguardring Epitaxialconstruction Lowforwardvoltagedrop,lowswitchinglosses Highsurgecapability Foruseinlowvoltage,highfrequencyinvertersfree wheeling,andpolarityprotectionapplications TheplasticmaterialcarriesU/Lrecognition94 | SAMYANGSAMYANG ELECTRONICS CO.,LTD. 三阳电子三阳电子有限公司 | SAMYANG | ||
Super-FastRectifiers | BILINGalaxy Semi-Conductor Holdings Limited 银河微电常州银河世纪微电子股份有限公司 | BILIN | ||
5.0ASURFACEMOUNTULTRAFASTDIODE | ZSELECZibo Seno Electronic Engineering Co.,Ltd 淄博圣诺电子淄博圣诺电子工程有限公司 | ZSELEC | ||
SmartFanforbetterthermalandacousticperformance | AXIOMTEKAxiomtek Co., Ltd. 艾讯科技艾讯股份有限公司 | AXIOMTEK | ||
SupportsBIOSQuickBoot | AXIOMTEKAxiomtek Co., Ltd. 艾讯科技艾讯股份有限公司 | AXIOMTEK | ||
WirewoundChipInductors | NIC NIC-Components Corp. | NIC | ||
WirewoundChipInductors FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE | NIC NIC-Components Corp. | NIC |
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