MSC8156SAG1000B数据手册恩XP中文资料规格书

描述 Description

The MSC8156 is based on the industry's highest-performance DSP core built on StarCore® technology and designed for the advanced processing requirements and capabilities of today's high-performance applications for the wireless broadband, medical imaging, aerospace, defense and advanced test and measurement markets. It delivers industry-leading performance and power savings, leveraging 45 nm process technology in a highly integrated system-on-chip (SoC) to provide performance equivalent to a 6 GHz single-core device. The MSC8156 helps equipment manufacturers create end products and services that integrate more functionality in a smaller hardware footprint.
The MSC8156 DSP delivers a high level of performance and integration, combining six fully programmable enhanced SC3850 DSP cores, each running at up to 1 GHz. Developed by NXP® and integrated on-chip, the MAPLE-B accelerator supports hardware acceleration for Turbo and Viterbi channel decoding and for DFT/iDFT and FFT/iFFT algorithms. A high-performance internal RISC-based QUICC Engine® subsystem supports multiple networking protocols to guarantee reliable data transport over packet networks while significantly offloading processing from the DSP cores.
The MSC8156 embeds large internal memory and supports a variety of advanced high-speed interface types, including two RapidIO® interfaces, two gigabit Ethernet interfaces for network communications, a PCI Express® controller, two DDR controllers for high-speed, industry standard memory interface and four multi-channel TDM interfaces. The MSC8156 allows a high degree of scalability through pin compatibility with all MSC825x and MSC815x DSP devices.

特性 Features

• Six StarCore® DSP SC3850 core subsystems each with:
• SC3850 DSP core at up to 1 GHz
• 512 KB unified L2 cache/M2 memory
• 32 KB I-cache, 32 KB D-cache
• Fully programmable 1056 KB M3 shared memory (SRAM)
• MAPLE-B - highly flexible programmable Turbo and Viterbi decoder supports configurable decoding parameters. It can perform up to 200 Mbps of Turbo decoding (six iterations) or up to 115 Mbps of K = 9 (zero tail) Viterbi decoding
• Two DDR 2/3 64-bit SDRAM interfaces at up to 800 MHz data rate
• Chip-Level Arbitration and Switching Fabric, non-blocking, fully pipelined, low latency
• High-speed interconnects:
• Dual 4x/1x Serial RapidIO at 1.25/2.5/3.125 Gbaud
• PCI Express 4x/1x
• Two SGMII
• Dual RISC QUICC Engine® supporting:
• RGMII gigabit Ethernet ports
• Serial peripheral interface (SPI)
• TDM highway 1024 ch., 400 Mbps, divided into four ports of 256
• DMA engine 16 bi-directional channels
• Other peripheral interfaces:
• UART
• I²C
• 32 GPIO
• 16 timers
• Technology
• Process: 45 nm SOI
• Voltage: 1-volt core, 2.5, 1.8/1.5-volt I/O
• Package: FC-BPGA (29x29) 1 mm pitch, RoHS
• This product is included in NXP®.s product longevity program, with assured supply for a minimum of 10 years after launch

应用 Application

Industrial
•Digital X-Ray
•Ultrasound