MSC8102数据手册恩XP中文资料规格书

描述 Description

Overview This product has been discontinued. See MSC8122.
The MSC8102 is a highly integrated system-on-a-chip that combines four StarCore® SC140 extended cores with an RS-232 serial interface, four time-division multiplexed (TDM) serial interfaces, thirty-two general-purpose timers, a flexible system interface unit (SIU), and a multi-channel DMA controller. The four extended cores can deliver a total 4000/4400 DSP MMACS performance at 250/275 MHz.
Each core has four arithmetic logic units (ALUs), internal memory, a write buffer, and two interrupt controllers. The MSC8102 targets high-bandwidth highly computational DSP applications and is optimized for wireless transcoding and packet telephony as well as high-bandwidth base station applications. The MSC8102 delivers enhanced performance while maintaining low power dissipation and greatly reduces system cost.
The MSC8102 device is designed to provide an optimal solution for 3G wireless base stations, to help eliminate many of the costly and power hungry ASICs and FPGAs required in today's systems for both symbol rate and for chip rate assist. In addition, the MSC8102 device allows customers to add next-generation features that efficiently use available frequencies and higher bit rates in 3G systems.
Efficient application software development is key in Our strategy to expedite customers' time to market. Since the MSC8102 is based on the same extended core as the MSC8101 device, developers can take advantage of currently available development tools and real-time operating systems (RTOS) from Metrowerks, an NXP® company, and third-party suppliers. In addition NXP is partnering with third-party vendors to provide integrated systems solutions that include GSM, CDMA, TDMA, and ITU G.7xx speech coders, hybrid echo cancellation, fax, modem, and xDSL software.
Archived content is no longer updated and is made available for historical reference only.

特性 Features

Four 250/275 MHz StarCore® SC140 DSP extended cores


\t•16 ALUs on a chip deliver up to 4000/4400 MMACS

\t•Performance equivalent to a 1.0/1.1 GHz SC140 Core



\t•Industry's largest on-chip SRAM memory
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\t\t\t•1436 KB of internal memory

\t\t\t•Efficient multi-level memory hierarchy

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\t•Dual external industry-standard 60x-compatible buses
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\t\t\t•9.6 Gbps peak bus throughput

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\t•Four independent Time-Division Multiplex (TDM) Interfaces
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\t\t\t•400 Mbps peak serial data throughput

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\t•Flexible memory controller
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\t\t\t•Accesses various external memories, including SDRAMs, SRAMs, SSRAMs, EPROMs, and Flash

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\t•Internal DMA controller that supports 16 time-multiplexed unidirectional channels, enabling data transfers of to and from the SC140 core M1 memory, the M2 memory, and the serial interfaces


The MSC8102 device is manufactured in 0.18 micron copper interconnect process technology, all in a 20 mm x 20 mm High Temperature Coefficient for Expansion Flip Chip Ceramic Ball-Grid Array (FC-CBGA HCTE) package.

Availability

Contact your local Sales office for information about availability.