首页 >MPC8266ADS-AIKIT>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
MPC826xA(HiP4)FamilyHardwareSpecifications | MotorolaMotorola, Inc 摩托罗拉加尔文制造公司 | Motorola | ||
MPC826xA(HiP4)FamilyHardwareSpecifications | MotorolaMotorola, Inc 摩托罗拉加尔文制造公司 | Motorola | ||
MPC826xA(HiP4)FamilyHardwareSpecifications | MotorolaMotorola, Inc 摩托罗拉加尔文制造公司 | Motorola | ||
MPC826xA(HiP4)FamilyHardwareSpecifications | MotorolaMotorola, Inc 摩托罗拉加尔文制造公司 | Motorola | ||
MPC826xA(HiP4)FamilyHardwareSpecifications | MotorolaMotorola, Inc 摩托罗拉加尔文制造公司 | Motorola | ||
MPC826xA(HiP4)FamilyHardwareSpecifications | MotorolaMotorola, Inc 摩托罗拉加尔文制造公司 | Motorola | ||
MaxPower35WBTL짰4chAudioPowerIC | TOSHIBAToshiba Semiconductor 东芝株式会社东芝 | TOSHIBA | ||
MaxPower35WBTL×4chAudioPowerIC Features •Highpower:POUTMAX(1)=35W(typ.) (VCC=14.4V,f=1kHz,JEITAmax,RL=4Ω) :POUTMAX(2)=31W(typ.) (VCC=13.7V,f=1kHz,JEITAmax,RL=4Ω) :POUT(1)=23W(typ.) (VCC=14.4V,f=1kHz,THD=10,RL=4Ω) :POUT(2)=20W(typ.) (VCC=13.2V, | TOSHIBAToshiba Semiconductor 东芝株式会社东芝 | TOSHIBA | ||
TelinkBLEseriesSoCunlocksthefullpotentialforBluetoothlowenergyapplications GeneralDescription TheTLSR8266/TLSR8266F512/TLSR8266F128/TLSR8266F1KisTelink-developedBLESoC solutionwhichisfullystandardcompliantandallowseasyconnectivitywithBluetoothSmart Readymobilephones,tablets,laptops.TelinkBLESoCsupportsBLEslaveandmastermode operation,in | ETCList of Unclassifed Manufacturers 未分类制造商 | ETC |
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