The FlipStack® CSP family utilizes Amkor’s industry leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities

FEATURES Package height down to 0.6 mm Design, assembly and test capabilities that enable stacking combinations of memory, logic and mixed signal type devices Established package infrastructure with standard CABGA and fcCSP footprints Consistent product performance with high yields and rel

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AMKOR

安靠科技

SMALL OUTLINE OPTOISOLATORS TRANSISTOR OUTPUT

Small Outline Optoisolators Transistor Output (Low Input Current) These devices consist of a gallium arsenide infrared emitting diode optically coupled to a monolithic silicon phototransistor detector, in a surface mountable, small outline, plastic package. They are ideally suited for high densi

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MOTOROLA

摩托罗拉

8-pin SOIC Single-Channel Phototransistor Output Optocoupler

Features • Closely Matched Current Transfer Ratios • Minimum BVCEO of 70 V Guaranteed – MOC205M, MOC206M, MOC207M • Minimum BVCEO of 30 V Guaranteed – MOC211M, MOC212M, MOC213M, MOC216M, MOC217M • Low LED Input Current Required for Easier Logic Interfacing – MOC216M, MOC217M • Convenient P

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ONSEMI

安森美半导体

SMALL OUTLINE SURFACE MOUNT PHOTOTRANSISTOR OPTOCOUPLERS

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FAIRCHILD

仙童半导体