MMP7077-127-1中文资料MELF PIN Diodes数据手册MACOM规格书

描述 Description

The MMP7077 MELF PIN diode is a thick I layer, low series resistance, low capacitance PIN diode available in a magnetic or in a nonmagnetic, square MELF hermetic ceramic package. It is manufactured using MACOM's proprietary diode process which optimizes the anode and cathode terminals of the die for full-face metallurgical bonds to the heat-spreading metal posts within the ceramic package. This unique geometry provides low electrical and thermal resistance within the surface mount package to enable high average power handling, low insertion loss for series diode applications and high isolation for shunt diode applications. The low thermal resistance (

特性 Features

·High Average Power Handling: > 50 W CW
·RoHS Compliant
·Low Thermal Resistance: < 20 ºC/W
·Thick I Layer for High Third Order Intercept: W = 80 µm Typical
·Low Capacitance for Low Insertion Loss and High Isolation: CT < 1 pF
·Low Series Resistance for Low Insertion Loss and High Isolation: RS < 0.5 O
·Available in Magnetic (CS127-1) or Nonmagnetic (CS128-1), Hermetically Sealed Surface Mount Package

应用 Application

·high peak and average power switch and attenuator applications