MMP7074-127-4数据手册MACOM中文资料规格书

描述 Description

The MMP7000-127 MELF PIN diode series is manufactured using MACOM’s proprietary diode process which optimizes the anode and cathode bonding area of the diode to the adjacent heat spreading metal posts within the ceramic package. This unique geometry provides lower electrical and thermal resistance within the surface mount package to provide higher average power performance to comparable surface mount diode packages. With lower Thermal Resistance ( 8 µS), provides better IIP3 distortion values > + 70 dBm, for SP2T Tx-Rx Switches. These devices are hermetically sealed and are constructed with materials to meet the stringent requirements for commercial and military applications. The devices are RoHS compliant.

特性 Features

·Ceramic Surface Mount Package
·RoHS Compliant
·Hermetically Sealed
·Lower Thermal Resistance (<20º C/W) for Higher Power
·Lower Rs <1.0 O (Lower Insertion Loss & Higher IIP3)

应用 Application

·High Average Power Switch and Attenuator applications