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MA4BPS101

PIN Diode Chips with Offset Bond Pads

Description These silicon - glass PIN diode chips are fabricated with M/A-COM’s patented HMIC™ process. They contain a single shunt silicon PIN diode embedded in a glass substrate with dual 75 x 150 micron bond pads located near the chip edges. The large pads allow use of multiple bond wires. The

文件:83.94 Kbytes 页数:4 Pages

MACOM

MA4BPS101

PIN diode chip with offset bond pad

MACOM

MA4E2514L-1116

M/A-COM
NA

MA4P1250-1072T

MACOM
SMD/SMT

MA4P504-1072T

MACOM
SMD/SMT

详细参数

  • 型号:

    MA4BPS101

  • 制造商:

    M/A-COM Technology Solutions

  • 功能描述:

    PIN ATTENUATOR/SWIT 70V 2PIN ODS-1244 - Bulk

供应商型号品牌批号封装库存备注价格
M/A-COM
24+
DIE100
5500
M/A-COM专营长期供应原装现货实单可谈
询价
M/A-COM
24+
DIE100
5500
原装正品 特价现货(香港 新加坡 日本)
询价
M/A-COM
24+
NA
2000
进口原装正品优势供应
询价
M/A-COM
23+
DIE100
50000
全新原装正品现货,支持订货
询价
M/A-COM
DIE100
5500
一级代理 原装正品假一罚十价格优势长期供货
询价
M/A-COM
2023+
5800
进口原装,现货热卖
询价
M/A-COM
24+
NA/
3750
原装现货,当天可交货,原型号开票
询价
M/A-COM
24+
DIE100
60000
全新原装现货
询价
L-com
25+
封装
500000
源自原厂成本,高价回收工厂呆滞
询价
MAC
24+
43
询价
更多MA4BPS101供应商 更新时间2025-10-5 14:26:00