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LX5552LU

WLAN Front End Modules (FEM);

LX5552 is a high-integration, high performance WLAN front-end module (FEM) for 802.11b/g/n and other applications in the 2.4-2.5GHz frequency range. LX5552 integrates a fully matched InGaP/GaAs Heterojunction Bipolar Transistor (HBT) power amplifier, a low noise amplifier based on InGaAs Enhancement mode pseudo-morphic high electron mobility transistor (E-pHEMT) technology, and a low-cost Depletion mode pHEMT (D-pHEMT) single pole double throw (SPDT) antenna switch in a single package. The Tx path of LX5552 features a two-stage monolithic microwave integrated circuit (MMIC) power amplifier with active bias circuitry, on-chip output power detector, and 50? input/output matching inside the package. With 3.3V supply voltage and 80mA bias current, the Tx path provides about 26dB power gain and +17dBm linear output power, with low total EVM (<3%) for 64QAM/ 54Mbps OFDM. Both gain and power are readily measured at antenna port with the insertion loss of the Tx switch included. The Rx path of LX5552 features small-signal gain of 12.5dB, low noise figure of 2dB, and high input third order intercept point (IIP3) of +5dBm with the insertion loss of the the Rx switch loss included. The LNA consumes about 10mA current with 3.3V supply voltage. LX5552 is available in a 16-pin, 3x3mm micro-lead package (MLPQ-16L). With its high level of functional integration, best-class performance, compact footprint and low profile, LX5552 offers an ideal front-end solution for the ever demanding design requirements of today’s WLAN systems, including 802.11b/g and the latest 11n MIMO applications.  ROHS, PB Free

MicrochipMicrochip Technology

微芯科技微芯科技股份有限公司

LX5552LU

2.4-2.5 GHz Front-End Module with Internally Matched Power Amplifier, LNA & SPDT Switch

DESCRIPTION LX5552isahigh-integration,high-performanceWLANfront-endmodule(FEM)for802.11b/g/nandotherapplicationsinthe2.4-2.5GHzfrequencyrange.LX5552integratesafullymatchedInGaP/GaAsHeterojunctionBipolarTransistor(HBT)poweramplifier,alownoiseamplifierbasedonInG

MicrosemiMicrosemi Corporation

美高森美美高森美公司

LX5552LU

Package:16-UFQFN 裸露焊盘;包装:剪切带(CT)Digi-Reel® 得捷定制卷带 类别:RF/IF,射频/中频和 RFID 射频前端(LNA + PA) 描述:IC WIRELESS LAN PA 16-MLPQ

MicrochipMicrochip Technology

微芯科技微芯科技股份有限公司

NSL-5552

TO-5PhotocellsPlasticEncapsulated

SILONEX

Luna Innovations Incorporated

RFPA5552

Wi-FiPowerAmplifier

QORVOQorvo, Inc

威讯联合威讯联合半导体(德州)有限公司

RFPA5552

Wi-FiIntegratedPAModule

RFMDRF Micro Devices

威讯联合威讯联合半导体(德州)有限公司

RFPA5552SB

Wi-FiPowerAmplifier

QORVOQorvo, Inc

威讯联合威讯联合半导体(德州)有限公司

RFPA5552SB

Wi-FiIntegratedPAModule

RFMDRF Micro Devices

威讯联合威讯联合半导体(德州)有限公司

RFPA5552SQ

Wi-FiIntegratedPAModule

RFMDRF Micro Devices

威讯联合威讯联合半导体(德州)有限公司

RFPA5552SQ

Wi-FiPowerAmplifier

QORVOQorvo, Inc

威讯联合威讯联合半导体(德州)有限公司

产品属性

  • 产品编号:

    LX5552LU

  • 制造商:

    Microchip Technology

  • 类别:

    RF/IF,射频/中频和 RFID > 射频前端(LNA + PA)

  • 包装:

    剪切带(CT)Digi-Reel® 得捷定制卷带

  • 射频类型:

    802.11b/g/n

  • 频率:

    2.4GHz ~ 2.5GHz

  • 特性:

    SPDT

  • 封装/外壳:

    16-UFQFN 裸露焊盘

  • 供应商器件封装:

    16-MLPQ(3x3)

  • 描述:

    IC WIRELESS LAN PA 16-MLPQ

供应商型号品牌批号封装库存备注价格
MICROSEMI
20+
16-MLPQ
3000
就找我吧!--邀您体验愉快问购元件!
询价
MICROCHIP/微芯
23+
16-UFQFN
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
询价
Microsemi
20+
16-UFQFN
3000
无线通信IC,大量现货!
询价
Microsemi
1942+
N/A
908
加我qq或微信,了解更多详细信息,体验一站式购物
询价
MICROSEMI/美高森美
2447
16-MLPQ
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
询价
Microsemi
24+
MLPG-12
5600
正常排单原厂正规渠道保证原装正品
询价
Microsemi Corporation
22+
9000
原厂渠道,现货配单
询价
Microsemi Corporation
23+
9000
原装正品,支持实单
询价
MICROCHIP(美国微芯)
24+
QFN12EP(2x2)
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
询价
MICROCHIP(美国微芯)
24+
QFN12EP(2x2)
3591
原装现货,免费供样,技术支持,原厂对接
询价
更多LX5552LU供应商 更新时间2021-9-14 10:50:00