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LSM6DSV16BX

iNEMO 3-axis accelerometer and 3-axis gyroscope: inertial module for UI and bone conduction with embedded machine learning core and Qvar specification

Features • Triple core for UI, bone conduction, and Qvar sensing • Power consumption: 0.95 mA in combo high-performance mode • “Always-on experience with low power consumption for both accelerometer and gyroscope • Smart FIFO up to 4.5 KB • ±2/±4/±8/±16 g full scale • ±125/±250/±500/±1000/±

文件:4.2338 Mbytes 页数:148 Pages

STMICROELECTRONICS

意法半导体

LSM6DSV16BX

iNEMO惯性模块:3D加速度计和3D陀螺仪

LSM6DSV16BX采用系统级封装,包含一个3D数字加速度计和一个3D数字陀螺仪(采用三核芯架构,通过专用的配置、处理和滤波功能在3个独立通道上处理加速度数据、角速度数据,以及Qvar传感数据)。\n\n LSM6DSV16BX在紧凑型封装(2.5 x 3.0 x 0.71 mm)中集成了UI传感器、音频加速度计,以及Qvar传感器。\n\n UI在高性能模式下的工作电流仅为0.6 mA,并且具有常开的低功耗特性,为可穿戴和TWS应用提供理想的运动体验。\n\n LSM6DSV16BX为音频和运动处理嵌入了先进的专用功能和数据处理,如:有限状态机和机器学习内核,并为物联网应用提供可导出的AI • 三个核心分别用于UI、骨传导,以及Qvar检测 \n• 功耗:在组合高性能模式下为0.95 mA \n• 加速度计和陀螺仪的低功耗带来“常开”体验 \n• 高达4.5 KB的智能FIFO \n• ±2/±4/±8/±16 g满量程 \n• ±125/±250/±500/±1000/±2000/±4000 dps 满量程 \n• 模拟供电电压:1.71 V到3.6 V \n• 独立IO供电(扩展的范围:1.08 V - 3.6 V) \n• 紧凑外形:2.5 mm x 3 mm x 0.71 mm \n• SPI / I²C和MIPI I3C® v1.1串行接口,支持主处理器数据同步功能 \;

ST

意法半导体

LSM6DSV16X

ST portfolio for smartphone platforms

TYPICAL APPLICATIONS • Contactless test factory automation and after sales services • Life proof hole-less personal devices • Contactless accessories • Contactless personal equipment docking hub and data transfer KEY FEATURE • True 10-finger multi touch • High SNR, hign noise immunity •

文件:3.51257 Mbytes 页数:32 Pages

STMICROELECTRONICS

意法半导体

LSM6DSV16X

iNEMO inertial module: always-on 3-axis accelerometer and 3-axis gyroscope with embedded machine learning core and Qvar electrostatic sensor

Features • Triple core for UI, EIS, and OIS data processing • Power consumption: 0.65 mA in combo high-performance mode • “Always-on experience with low power consumption for both accelerometer and gyroscope • Smart FIFO up to 4.5 KB • Android compliant • ±2/±4/±8/±16 g full scale • ±125/±

文件:5.50782 Mbytes 页数:196 Pages

STMICROELECTRONICS

意法半导体

LSM6DSV16XTR

iNEMO inertial module: always-on 3-axis accelerometer and 3-axis gyroscope with embedded machine learning core and Qvar electrostatic sensor

Features • Triple core for UI, EIS, and OIS data processing • Power consumption: 0.65 mA in combo high-performance mode • “Always-on experience with low power consumption for both accelerometer and gyroscope • Smart FIFO up to 4.5 KB • Android compliant • ±2/±4/±8/±16 g full scale • ±125/±

文件:5.50782 Mbytes 页数:196 Pages

STMICROELECTRONICS

意法半导体

供应商型号品牌批号封装库存备注价格
ST
330702
只做正品
询价
24+
10
询价
STMicroelectronics
24+
SMD陀螺仪
6598
传感器方案陀螺仪供应
询价
ST(意法半导体)
23+
LGA-14(2.5x3)
5000
传感器陀螺仪/只做原装现货
询价
STMICROELECTRONICS
24+
con
35960
查现货到京北通宇商城
询价
ST/意法
24+
CLGA
60000
询价
ST(意法)
25+
封装
500000
源自原厂成本,高价回收工厂呆滞
询价
STMicroelectronics
25+
N/A
20948
样件支持,可原厂排单订货!
询价
STMicroelectronics
25+
N/A
21000
正规渠道,免费送样。支持账期,BOM一站式配齐
询价
ST(意法)
23+
15000
专业帮助客户找货 配单,诚信可靠!
询价
更多LSM6DSV16BX供应商 更新时间2026-2-3 14:01:00